Tyco Electronics (TE), a global leader in engineered electronic components and solutions, launches the solderless LED socket, Type LS, designed specifically for use with the new Philips Lumileds LUXEON™ S LED. Debuting at Strategies In Light 2011 in Santa Clara, California, the new product offers a solderless termination that complements this newly-released lighting-class LED by Philips Lumileds.
The Type LS socket complies with UL-1977 specifications and is designed with insulation displacement technology to allow for quick and easy termination of 24 AWG wires to the socket. An integral stainless steel spring within the socket ensures that uniform and adequate normal force is applied to the LED for optimum thermal performance.
Additionally, the product simplifies the positioning of the Luxeon S LED on a heat sink by utilizing a locator -- a plastic frame that is first placed on the heat sink to correctly orient the LED in its position prior to socket attachment. Once positioned, only three commercially-available #4 or M3 screws are needed to rapidly secure the socket to the heat sink.
Designed to maximize optical efficiency in un-lensed applications, the shape of the Type LS socket ensures that 98 percent of the light emitted from the LED is unobstructed. Offered both with and without optics snap features, it provides flexibility for fixture designers by providing features for a secondary optic attachment. For optical flexibility, the matching Venla series of reflectors are offered by LEDIL OY in a wide variety of beam angles and offer a simple snap-fit to the socket.
Stop by the TE booth #400 at Strategies in Light 2011 to learn more about the new solderless LED socket, Type LS, and our broad range of SSL products, or visit us at www.te.com/lighting. Customer drawings, 3D-model files and application specifications are available on this site. Production will begin in late March 2011. Additional information can be obtained by contacting the TE Product Information Center at 800-522-6752.
The TE Type LS socket, LUXEON® S LED, LEDIL reflectors and associated driver solutions will also be stocked and available through Future Lighting Solutions ( www.FutureLightingSolutions.com), a leading provider of LED lighting solutions.
Crystek has introduced the LL335 Series Cable Assemblies, a new addition to their line of Low-Loss RF Coaxial Cables. Designed to operate up to 18GHz, the CCSMA-MM-LL335 Cable Assemblies boast extremely low loss, with attenuation ratings of 0.03 dB/ft at 500 MHz, and 0.20 dB/ft at 18GHz.
Crystek LL335 cables offer a minimum bend radius of 1.5 in. and are available in-stock in 36-, 48- and 60-inch lengths. The cables are supplied with high frequency SMA or N-Type connectors, featuring rugged stainless-steel solder-clamp construction and heavy-duty strain relief with a neoprene jacket.
These low-loss cables offer shielding effectiveness of greater than -100dB with a wide operating temperature range of -45 to +125 degree C.
Crystek provides custom build-to-print services for all its cable assemblies, from prototypes to high-volume production. Crystek's stocking distributors also support a large variety of other coaxial cable assemblies in a wide range of configurations. For pricing details, contact Crystek Corporation.
Family datasheets are available for download at www.crystek.com
Harwin, the leading hi-rel connector and SMT board hardware manufacturer, was delighted to host a recent visit from Penny Mordaunt, its local Portsmouth North constituency MP. On a fact-finding mission to ‘better understand the needs of the UK manufacturing industry’, Ms. Mordaunt spent an instructive morning at Harwin’s Farlington factory, being shown round by Harwin Chairman Damon de Laszlo and CEO Andrew McQuilken, when she took the opportunity of speaking with many company employees.
Commented de Laszlo: “It is gratifying that politicians are finally listening to the needs of industry and that the voices of SMEs such as Harwin are being heard. To ensure a continued and full recovery from the recent recession, manufacturers such as ourselves must be allowed to be competitive, free from unnecessary costs and restrictions. Politicians have a full responsibility to create an economic environment where enterprising businesses can succeed, and we are pleased that our local MP has taken such a keen interest in our activities.”
Ms. Mordaunt was impressed by Harwin’s technological capabilities and in its policy of large-scale capital investment, along with its apprenticeship programme. The company was also able to demonstrate its international presence, having recently returned from a highly-successful attendance at the major electronics event Electronica in Munich, where a record number of orders and enquiries were taken.
Tyco Electronics (TE) launches new highly-compact 40-Gbps QSFP+ optical transceivers -- parallel fiber optical modules with four independent optical transmit and receive channels for increased board density. This extension to TE’s QSFP product portfolio for the broad Ethernet and InfiniBand standards marketplace combines the high-density and low-power benefits of parallel modules with some of the key advantages normally associated with SFP+ based modules, such as digital diagnostic monitoring for improved systems management.
The QSFP+ optical transceivers can be used in switches, routers, data centers and other Ethernet applications where they provide more than 60 percent increase in faceplate PCB density and simplify heat management through reduced power consumption (power dissipation of 0.8W) of more than 50 percent compared to the use of four individual SFP+ modules. Offering a digital diagnostic monitoring interface, the new transceivers allow customers to easily manage and monitor key module parameters of a system through alarm and warning flags for module performance.
QSFP+ MSA- and SFF-8436-compatible, the transceivers are electrically hot-pluggable allowing for port population on demand and in the field. The latch mechanism eases insertion into board-mounted cages and optical connectivity is enabled via industry standard MPO/MTP-terminated fiber ribbon.
The QSFP+ optical transceivers will be part of a live interoperability industry demonstration at the Ethernet Alliance booth #1253 at OFC/NFOEC 2011. For more product information, visit http://www.te.com/products/QSFPplus-Transceivers
The continuing demand for higher functionality and smaller equipment size require smaller and smaller components. This is also true for connectors. Therefore the 13F-6X RJ-45 jacks from YDS (Distributor:MSC Vertriebs GmbH) in Single Small Module form factor are more and more used by system designers. Including integrated Ethernet magnetics these RJ45 jacks measure just 15.1 x 17.6 mm with only 11.5 mm profile.
With more than fifty different magnetic configurations system designers can choose the exact fitting Single Small Module for every PHY. All models meet or exceed IEEE 802.3 and ANSI X3.263 standards, including ≥ 350 µH OCL at 8 mA and 1500 Veff minimum isolation. They are designed for 100 base transmissions over UTP-5 cable. All models feature low crosstalk, low insertion loss and high return loss.
The Single Small Modules are a tab-down design. They are RoHS compliant and withstand soldering temperatures up to 250 degree C. Just as the traditional 13F6X series form factors the Single Small Modules are a perfect and cost-optimised solution for industrial computers, network equipment, industrial controls and other systems with 10/100 Base-T Ethernet.
Harwin, the leading hi-rel connector and SMT board hardware manufacturer, has announced that users of its C90 industrial range of circular connectors can now benefit from 360 degree EMC screening via a new series of screening braid adapters.
Fully RoHS-compliant and available from stock in many standard sizes, the new adapters are manufactured in black zinc nickel plated aluminium alloy and enable easy connection of RFI and EMI screening braid to Harwin’s popular C90 connector series.
A choice of termination is available. The first option is a constant force spring system, allowing termination without special tooling. Alternatively, a Tie-Dex Micro Band system may be used which is easily terminated using industry-standard application tooling. Both termination styles provide full 360 degree attachment of the braid ensuring optimum screening performance.
Comments Product Manager Paul Gillam: “Designed for use in harsh industrial environments, agricultural and construction equipment, these adapters, together with the appropriate braids, provide proven EMC performance. Devices are in stock now for immediate delivery.”
TTI, Inc., the global distributor of Passive, Interconnect, Relay & Switch and Discrete components, has been named European Distributor of the Year by Syfer Technology, the specialist manufacturer of multilayer ceramic capacitors and filters.
Commented Syfer’s marketing manager, Chris Noade: “TTI has been a strategic supply chain partner for Syfer for many years. We have given them this award, not only for excellent sales, but also because of the close cooperation we have with them and the highly successful manner in which they introduce our new products to their customers, helping to create and grow business in new markets.”
Added Felix Corbett, newly-appointed TTI’s Director of Supplier Marketing, responsible for Passives and Discrete Components in Europe: “We are delighted to win this title. Syfer provides high levels of service and excellent MLCC and Filtering products, particularly in application specific areas. With the flexibility to also offer custom solutions, Syfer is a key partner for TTI and our customers.”
About TTI, Inc.
TTI’s philosophy is "Lead by Design", and the company differentiates itself by focusing on people, parts and process. TTI, Inc. is a specialty distributor of passive, interconnect, relay & switch and discrete components. The company has developed a policy in Europe of being the distributor of choice for customers and suppliers alike by introducing new product technologies from key supply partners to its customers - and by stocking broad and deep across its franchise base. TTI also operates sophisticated inventory management processes which ensure that it has the ability to service changes in component demand due to fluctuating markets and supply chains.
TE Connectivity (TE) has announced a product line of standard antennas that can meet many customers’ needs.
The new standard range of antennas offer low-profile, high-performance stamped metal, flexible printed circuits (FPC) and printed circuit boards (PCB) embedded antenna solutions for single through penta band applications. These antennas are designed and manufactured to comply with stringent operating requirements and allow a wireless designer to select from a broad range of antennas with the frequencies that meet the needs of most wireless products. TE’s global presence with manufacturing and design locations across the world enables TE to offer advanced antenna solutions with combinations of features in a variety of shapes and sizes, to suit customer unique wireless devices.
All standard antennas address the needs of a variety of wireless applications and offer several advantages such as:
•Small and lightweight
•Broad frequency range
•Minimum or no matching components required
•Eliminated tooling lead-time and cost
The standard antennas can be easily integrated into a wide range of wireless products including mobile/smart phones, notebooks/desktop computers, routers, base stations, navigation and gaming devices, IPTV, wireless alarm/security/monitoring systems, smart grid applications, etc.
For more information on TE’s antenna product line, please visit
TE (logo) and TE Connectivity are trademarks.
Celab, the high reliability power solution design company, announces today the launch of their new web site for military and industrial applications. Categorized by market, the site provides detailed product information on the range of AC/DC, DC/DC and UPS units.
Military products, both custom, semi-custom and COTS, cater for the demanding environments of a variety of aerial, naval and land -based platforms and are designed to meet stringent MIL standard specifications. Industrial products include a comprehensive range of uninterruptible power supplies (UPS) designed specifically to meet the needs of cable television and telephone distribution equipment operating in harsh and remote locations.
The new site is now live at www.celab.co.uk
Maxwell Technologies is introducing a 56V UPS ultracapacitor module designed specifically to address the short-term ride-through and bridge power requirements of uninterruptible power supply (UPS) systems for mission-critical installations such as data centers, hospitals, factories and telecommunication facilities. They are available in capacities 52F, 65F, 87F and 130F at distributior Rutronik now.
The Maxwell 56V UPS module can be relied upon to perform for up to 15 years in a data center with no maintenance or conditioning. The non-toxic ultracapacitor modules cost effectively replace batteries. Therefore they provide UPS systemintegrators an customers tho lowest total cost of ownership alternative to lead-acid batteries for short-term ridethrough and bridge power applications.
Rutronik Elektronische Bauelemente GmbH
Crystek's CVCO55CC-3830-3830 VCO (Voltage Controlled Oscillator) operates at 3830MHz with a control voltage range of 0.5V~4.5V. This VCO features a typical phase noise of -108 dBc/Hz @ 10KHz offset and has excellent linearity. Output power is typically +7dBm.
Engineered and manufactured in the USA, the model CVCO55CC-3830-3830 is packaged in the industry-standard 0.5-in. x 0.5-in. SMD package. Input voltage is 8V, with a max. current consumption of 35mA. Pulling and Pushing are minimized to 1.0MHz and 0.2MHz/V, respectively. Second harmonic suppression is -15dBc typical.
The CVCO55CC-3830-3830 is ideal for use in applications such as digital radio equipment, fixed wireless access, satellite communications systems, and base stations.
For pricing details, contact Crystek Corporation.
Family datasheets are available for download at www.crystek.com. For more information,
contact sales at Crystek Corporation, 12730 Commonwealth Drive, Ft. Myers, FL 33913.
Tel: 800-237-3061 or 239-561-3311; Fax: 239-561-1025; E-mail: firstname.lastname@example.org
A free online pulse energy calculator that helps designers select the right wirewound resistor for their application is now available on the website of Vishay Intertechnology, Inc.
Vishay's new Joule School online pulse energy calculator (available at http://www.vishay.com/resistors/pulse-energy-calculator/) allows designers to determine the energy of a pulse that could go through a resistor in their application. The calculator is perfect for selecting wirewound resistors for applications exposed to large pulses such as a capacitive charge/discharge or lightning surge, including phone towers, solar power systems, windmills, welders, test equipment, and power supplies.
Simple to use, Joule School offers designers a choice of three pulse types to calculate: square wave pulse, capacitive charge/discharge pulse, and exponentially decaying pulse. After selecting the pulse type, users enter the required variables for their application and click "Compute" to determine the pulse energy and average power. To help determine the best wirewound resistor to meet the needs of their application, designers can then contact Vishay with the pulse information.
Vishay Intertechnology, Inc.
AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has expanded its wide range of SMD tantalum polymer capacitors to include new TCN series devices that deliver industry’s highest CV rating in a low profile package. TCN tantalum polymer capacitors use an ‘undertab’ design to optimize the internal maximum volumetric efficiency, enabling these parts to offer the popular 150µF/6.3V rating in an L case measuring just 3.5 x 2.8mm and with a profile of only 1mm.
The 150µF/6.3V tantalum polymer capacitor is a favourite choice of mobile phone manufacturers for power module stabilization applications. The new TCN series devices continue the miniaturization trend in electronic devices, allowing designers to produce smaller, thinner mobile devices or to increase functionality within the same product dimensions. The first TCN parts that have been released include 150uF 6.3V devices in two 3528 case sizes – L case with a profile of 1.0mm and the T case which measures 1.2mm high. Further high volumetric efficiency TCN series ‘undertab’ polymer capacitors will be released during 2011.
TCN polymer capacitors are suitable for continuous operation with just 20% voltage derating due to their reduced ignition failure mode and surge current robustness. Tantalum capacitors in general are more stable against changes in operational temperature and applied voltage than comparable multilayer ceramic capacitors (MLCCs). TCN polymer tantalum capacitors are RoHS-compliant and contain no halogens, which top equipment manufacturers are anxious to eliminate. In addition, the conductive polymer cathode is inherently low oxygen bearing which helps to negate ignition failures - unlike other tantalum capacitor technologies which can be susceptible to this failure mode.
Murata announced the introduction of a series of capacitors specifically designed to provide DC smoothing and acoustic noise reduction in LED lighting applications. As the market for LED lighting has steadily grown customers have recognized that a capacitive DC bias, that results in less actual capacitive value, and a piezo-electronic phenomenon within capacitors has been the cause of light flickering and acoustic noise. Previously, many designers have avoided the use of ceramic capacitors in LED lighting applications even though they have superior size and higher temperature reliability.
The GR3 and RDE series of multi layer ceramic capacitors (MLCC) have been designed by Murata to be incorporated in LED lighting circuits, immediately following the bridge rectification stage, to provide DC supply smoothing and EMI filtering. The GR3 family is for reflow soldering use and the RDE family provides radial leaded insertion production. Compared to standard ceramic capacitors, tests by Murata showed a 10dB reduction in acoustic noise by using the new GR3 MLCC capacitors. Further noise reductions are possible with the RDE leaded parts. Both families provide better DC bias and acoustic noise reduction performance than X7R series.
The GR3 is available in 250, 450 or 630 VDC rating and popular capacitances starting from 10nF and up to 1,000nF for the 250 VDC range, to 560nF for 450 VDC and 270nF for the 630 VDC. Package sizes for the GR3 series include 0805, 1206, 1210, 1812 and 2220. The RDE leaded series has the same voltage rating as the GR3 series with capacitances of 10nF to a maximum of 2.2uF for the 250 VDC part, 1.2uF for the 450 VDC, and 560nF for the 630 VDC component.
AVX Corporation, a leading manufacturer of advanced passive components and interconnect solutions, has created a new CD detailing its tantalum and niobium oxide capacitors which will help designers access information more easily and select the correct capacitor for their applications. The interactive and user friendly CD, called The AVX Tantalum Office, has been issued by AVX Corporation to bring wide range of information not only to industry professionals but also to be used as an educational tool by students and the general public.
Featuring a 3D animated character called Mr OxiCap, users can quickly and easily find what they are searching for and have fun at the same time. The CD contains product offerings, technical papers and market specifications or requirements, as well as presentations, teardown reports and information on the latest software tools.
Designed as a walkthrough guide, Mr. OxiCap welcomes users in a reception area and takes them though to a virtual conference room, where there’s an explanation about what a tantalum capacitor is and information about its structure and how it is manufactured. In the laboratory area, users are encouraged to explore tantalum uses and applications. Finally, in the library, there’s more information about current and future product offerings from AVX.
“Our aim has been always to be easy to work with, but at the same time to be supportive, educational and useful. I am pleased about the creative approach that we have developed for the CD, offering engineering knowledge in a “play & explore” format, combined with a practical approach which provides key information in minimum clicks. I hope users of the Tantalum Office CD enjoy this unique type of electronic product catalogue.” said Tomas Zednicek, AVX Tantalum Technical Marketing Manager.
Vishay Intertechnology, Inc. introduced a new precision low-TCR thin film resistor offering a wide operating temperature range of - 55 degree C to + 215 degree C. Providing nearly a 100 ?C extension in operating temperature range over traditional thin film chip resistors, the PLTT features a low standard TCR of ± 5 ppm/degree C and tolerances down to ± 0.02%.
With stable film and performance characteristics of 500 ppm at + 215 degree C for 2000 hours, the resistor released today is optimized for the low-noise, single-signal processing required to compensate for low offset and temperature drift in high-temperature environments, including down-hole applications, high-precision oil and gas exploration, and telecommunications and industrial equipment.
Offered in the 0805 case size, the PLTT resistor offers a resistance range from 250Ohm to 50 kOhm, with non-standard values available. The device features very low noise of < - 35 dB, low voltage coefficients of 0.1 ppm/V, a power rating of 250 mW, and a 75 V to 200 V working voltage range.
The PLTT features a high-purity ceramic substrate, 10 μin gold terminations over nickel barrier for high-temperature HMP soldering, and corrosion-resistant special passivation method (SPM) enhancement. The resistor is compliant with RoHS Directive 2002/95/EC, halogen-free according to the IEC 61249-2-21 definition, and flame-resistant in accordance to UL 94 V-0.
Samples and production quantities of the PLTT resistor are available now, with lead times of 10 to 12 weeks for standard orders. Follow Vishay thin film resistors at http://twitter.com/vishayindust
Vishay Intertechnology, Inc.
Honeywell announced the SL353 Series Micropower Omnipolar Digital Hall-Effect Sensor Integrated Circuits (ICs). The SL353 Series uses a BiCMOS IC design, a new Honeywell technology, which makes it possible to add more performance and functionality while reducing the size of the IC (compared to bipolar technology).
The low supply voltage (as low as 2.2 Vdc) for the SL353 Series, combined with very low average current (1.8 µA typ. for the SL353LT - the lowest in its class), reduces power consumption, extends battery life, and promotes energy efficiency. The product is available in two duty cycle configurations to accommodate a variety of low-power applications:
• SL353HT: High duty cycle (13% typ.) and low current drain (0.33 mA typ., 2.8Vdc typ.) for use in energy-efficient, "green" products requiring higher switching frequencies.
• SL353LT: Very low duty cycle (0.013% typ.) and ultra low current drain
(1.8 µA typ., 2.8 Vdc typ.) resulting in extended battery life for use in battery-operated, mobile applications.
Built-in timing circuitry in the SL353 Series turns the power to the IC on for a very short time - it is off for the balance of the period - significantly reducing the average current consumption. The push-pull output does not require an external pull-up resistor, which simplifies interface with common electrical circuits and potentially reduces PC board space and costs to the customer. The non-chopper stabilized design means that no filter is needed to compensate for the noise generated by this technique, helping to reduce PC board space, part counts, and application costs. The balanced integrated circuit provides stable operation over a wide temperature range of
-40 C to 85 C [-40 F to 185 F].
Because these sensors can be operated by a North pole or a South pole, they do not require the magnet polarity to be identified, allowing easier installation and potentially reducing system costs. The SOT-23 subminiature package size requires less PC board space, allowing for use in smaller assemblies. These sensors are supplied on tape and reel which allows for a compact design with automated component placement, helping to reduce manufacturing costs.
The SL353 Series Micropower Omnipolar Digital Hall-Effect Sensor ICs are designed for battery-operated, mobile equipment such as: door or lid closure detection in notebooks, scanners, hand-held industrial computers or instrumentation; mobile printer head position sensing; small hand-held medical or dental equipment; battery-operated infusion pumps, insulin pumps or other wearable medical devices; trigger switches for battery-operated hand tools; reed switch replacement in battery operated security systems; magnetic encoders for building access (array); power switch or open-close detection in small battery-operated appliances (vacuum cleaner, fan, etc.); and gas or water consumption measurement in remote, battery-operated utility meters.
Tensilica,® Inc. announced that it is extending its leadership in IP (intellectual property) cores for compute-intensive dataplane and DSP (digital signal processor) functions such as imaging, video, networking and baseband wired/wireless communications. Any application that requires extensive data processing will significantly benefit from the breakthrough features – particularly those that quadruple data bandwidth – built into Tensilica’s new Xtensa® LX4 dataplane processor (DPU) for SOCs (system-on-chips).
The new Xtensa LX4 DPU supports wider local data memory bandwidth of up to 1024 bits per cycle, wider VLIW (very long instruction word) instructions up to 128 bits for increased parallel processing, and a cache memory prefetch option that boosts overall performance for systems with long off-chip memory latency. Tensilica is already using many of these capabilities in its recently introduced ConnX BBE64 DSP for LTE Advanced communications.
“The strength of Tensilica’s DPUs is the ability to combine control and digital signal processing functions in cores that can be optimized to provide 10x to 100x performance improvement compared to a standard RISC or DSP core,” stated Steve Roddy, Tensilica’s vice president of marketing and business development. “Now, with Xtensa LX4, Tensilica offers IP cores that range from an ultra-small programmable DPU as exemplified by a 1GigaMAC DSP in 0.01mm2 (in 28 nm process technology) up to the ConnX BBE 64-128, the world’s highest performance licensable DSP IP core with over 100 GigaMAC per second performance.”
Wider Data Fetch for Higher Bandwidth
Tensilica’s Xtensa LX4 DPU has four times the local data memory bandwidth of the Xtensa LX3 DPU, with up to two 512-bit load/store operations per cycle. Designers can now easily create super-wide SIMD (single instruction multiple data) DSPs that pump more data into more MAC (multiply accumulate) units each clock cycle for extremely fast performance. This makes Xtensa LX4 DPUs ideal for wired and wireless baseband processing, video pre- and post-processing, image signal processing, and various network packet processing functions.
This enhanced local memory bandwidth is in addition to Tensilica’s existing customizable local port and queue interfaces that provide unlimited point-to-point data and control signal bandwidth. Tensilica now offers both the unique Port/Queue interfaces that allow connections between Xtensa DPUs and other system block just like traditional RTL block interconnection, and the new ultra-high bandwidth local memory connections.
Wider Instructions for Increased Parallel Processing
With Xtensa LX4, Tensilica doubles the allowable width of its Flexible Length Instruction eXtensions (FLIX) instructions from 64- to 128-bits wide. This allows the execution of twice the number of independent operations per clock cycle. Every wide FLIX instruction is seamlessly intermixed with the shorter base Xtensa instruction set so there is no mode switch penalty when using FLIX.
With FLIX, the Xtensa LX4 DPU can deliver the ultra-high-performance characteristics of a specialty VLIW processor with smaller code size than competing VLIW DSPs. Tensilica’s Xtensa C/C++ compiler automatically extracts parallelism from source code and bundles multiple operations into single FLIX instructions. An Xtensa LX4 DPU with wide FLIX instructions running parallel operations at low clock frequency can often deliver performance matching that of larger, higher MHz non-VLIW cores but consumes far less energy completing the same task.
Prefetch Reduces Cycle Counts
The new data prefetch option reduces cycle counts in long-latency designs by fetching data from system memory ahead of its use. This way, the data is ready and waiting when the application code needs it, reducing wasted cycles when the DPU would have to wait for data. The benefits are seen most when streaming data from contiguous memory locations. It’s a much simpler alternative for memory access optimization than adding a separate DMA (Direct Memory Access) engine, which requires additional software programming and application code tuning.
Key to Success: Automation
Tensilica provides tools that automate not only the creation of the DPU hardware but also the creation of the matching comprehensive software development tool set. Because the underlying base Xtensa instruction set is never changed, designers can access Tensilica’s robust ecosystem of third party applications software and development tools even after heavily customizing the Xtensa DPU.
Customizable Xtensa DPUs are compatible with major operating systems, debug probes and ICE (in-circuit emulator) solutions, and come with an automatically generated, complete software development toolchain including an advanced integrated development environment based on the Eclipse framework, a world-class compiler, a cycle-accurate SystemC-compatible instruction set simulator, and the full industry standard GNU toolchain.
New with this release is Tensilica’s Vectorization Assistant tool, a first-of-its-kind tool that suggests ways developers can improve compiler vectorization of their C-code when running on SIMD (single instruction multiple data) DSPs. The Vectorization Assistant explains what is preventing further vectorzation so the software developer can improve the source C-code to take advantage of the DPU’s parallel execution units.
Microchip announces an expansion of its 8-bit segmented LCD microcontroller (MCU) family with five new devices combining low-cost LCD control with industry-leading low power consumption. The PIC16LF190x MCUs enable the implementation of LCD into cost-sensitive power-efficient designs, such as security tokens, smart cards, medical devices, home appliances, key fobs and other segmented LCD applications. Featuring eXtreme Low Power (XLP) technology, with sleep currents down to 20nA and a typical active current of 35 microamperes per MHz, the MCUs extend battery life, whilst maintaining accurate timing with a RTC, and driving a segmented LCD.
Incorporating Microchip’s Enhanced Mid-range architecture, the PIC16LF190x family provides essential features and performance without incurring the cost of unused peripherals. The optimised feature set integrates up to 14 KB of Flash programme memory, up to 512 Bytes of RAM, and up to 14 10-bit Analogue-to-Digital Converter (ADC) channels, as well as serial communication and the capability to drive up to 116 LCD segments. The MCUs also feature XLP technology for extended battery life, and capabilities such as an integrated temperature indicator to provide crystal-accuracy compensation, as well as support for low-power RTC and low-voltage detect using the internal ADC and voltage reference.
The PIC16LF190x MCUs can be evaluated with the F1 Evaluation Kit (DM164132), priced at $69.99, and F1 Evaluation Platform (DM164130-1), priced at $39.99, as well as the PICkit™ 3 In-Circuit Debugger (PG164130) at $44.95.
The PIC16LF1902, PIC16LF1903 and PIC16LF1906 MCUs are available in 28-pin SPDIP, SOIC, SSOP and 4 mm x 4 mm UQFN and die packages, whilst the PIC16LF1904 and PIC16LF1907 MCUs feature 40-pin PDIP, 5 mm x 5 mm UQFN and die packages, as well as a 44-pin TQFP.
For more information, visit Microchip’s Web site at http://www.microchip.com/lcd
KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces that Manncorp will highlight its Auto-Focus Power Software for reflow ovens in Booth #2625 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
This next-generation thermal process optimization system “Googles” available oven recipes and automatically selects the optimum process for individual applications. The standard Auto-Focus automatically selects the recipe that positions the process in the center of the process window or, alternatively, the fastest throughput.
The new, advanced Auto-Focus Power software product adds a third optimization criterion, namely by selecting the recipe that yields lower energy consumption. Third-party research has verified the ability of the Auto-Focus Power option to reduce energy consumption. This key feature results in significant cost savings in today’s environment of increasing energy prices.
Customers that order KIC products (Explorer with Navigator, KIC Vision or KIC 24/7) from Manncorp during the IPC APEX EXPO will receive a complimentary Apple iPad 2. For more information, visit Manncorp in Booth #2625 at the show.
For more information about KIC’s Auto-Focus Power Software, visit www.kicthermal.com
Essemtec, the Swiss manufacturer of production systems for electronics, strengthened its market presence in Eastern Europe by founding a new subsidiary in Warsaw, Poland in February 2011. Managing Director is Miroslaw Borkowski.
Following the strategy of other European markets, Essemtec has founded a subsidiary in Warsaw, Poland. Essemtec's target is to improve the direct customer relationship and to increase sales and marketing activities in Eastern Europe. Managing and Sales Director Miroslaw Borkowski knows Essemtec products well ― he has been working for PB Technik, Essemtec's representative in Poland.
While PB Technik continues to sell the Essemtec products as before, Essemtec Poland will focus on automatic production systems of higher capacity and speed. Essemtec Poland can offer real turnkey solutions for SMT production, including printer, dispenser, pick-and-place, reflow oven, storage systems, handling equipment and software including process know how, from one source, providing significant time and cost benefits to customers.
Essemtec Poland will exhibit the highly flexible and successful FLX2011-V pick-and-place on booth L-24 in hall 4 at the upcoming fair Automaticon, taking place in Warsaw from April 5-8.
Good news for electronics manufacturing sites with frequent product changeovers of small lot sizes: With Random Setup, the SIPLACE team of ASM Assembly Systems (formerly Siemens Electronics Assembly Systems) is introducing an innovative setup concept that significantly simplifies and accelerates the setup procedure. With Random Setup, operators can place feeders and components anywhere on the line or on the feeder table instead of in specific tracks and positions. The SIPLACE placement machines recognize the newly added X-feeders and adjust the placement programs automatically. Electronics manufacturers benefit from significantly faster setups and improved line productivity, because the setups for upcoming products can now be executed efficiently and without having to stop the line. At the same time, converting to Random Setup makes setup errors virtually impossible and significantly reduces the amount of feeders and feeder carts needed in the setup preparation area. The intelligent SIPLACE X-feeders even provide visual aids for the setup process and signal via their built-in LEDs whether they will still be needed for upcoming products or can be safely removed.
“The smaller the lot sizes and more frequent the product changeovers, the more important efficient setup processes become for productivity in electronics manufacturing. Our SIPLACE developers thought long and hard about today’s production requirements. With Random Setup they are now introducing a setup concept that was designed specifically for the needs of modern high-mix environments,” says Hubert Egger, Marketing Manager SIPLACE Software, about the benefits of the new concept. “Instead of minimizing the pure placement time for a product in isolation, which is what is done in traditional setup concepts, Random Setup raises the total line productivity by optimizing the complete throughput time, including setup times.”
New approach: The placement program adjusts to the setup
With SIPLACE Random Setup, the physical setup is not based on the optimized placement program, but the placement program automatically adjusts itself to the actual feeder positions. The operating staff can place the SIPLACE X-feeders in any open slot on the line or on the feeder cart. This can even be done while the line keeps running (hot-swap). The SIPLACE machine recognizes the new feeders automatically based on their unique IDs when they register. If the components and feeders were previously “kitted” by scanning their respective barcodes, the placement machine also receives all the necessary component-related information and adjusts its placement process accordingly. As a result, floating setups can be executed on the line by replacing individual feeders one at a time. The X-feeders even indicate via their built-in LEDs whether they will still be needed for one of the upcoming products or can be removed from the line.
The preparatory kitting process benefits from the Random Setup features as well. At the click of a button, operators can generate a so-called delta setup, which highlights only those components for the next job which are not already installed on the line in their respective feeders. If the setup changeovers are executed with feeder carts, Random Setup speeds up this procedure as well. Since the feeders can be positioned anywhere on the line and in the setup preparation area, with SIPLACE Setup Center verifying each setup, the typical setup errors resulting from a feeder being positioned in the wrong track are now a thing of the past.
Ideal for high-mix environments
Random Setup enables electronics manufacturers who have to deal with small lots, frequent product changeovers or lots of prototypes to increase the total productivity of their SMT lines by minimizing their setup times and their total throughput times. At the same time, Random Setup reduces the feeder and feeder cart inventory in most cases, thus reducing the manufacturer’s assets and improving his capital position.
For more information about ASM Assembly Systems (SIPLACE), please visit www.siplace.com
Blakell Europlacer Ltd., a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that its multi award winning iineo platform will feature as part of the Future Proof Assembly Line at Booth N401 during NEW 2011, scheduled to take place 12-13 April 2011 in the NEC Pavilion, Birmingham, UK.
The Future Proof Assembly Line is a live production line that will feature an amalgamation of companies coming together to show cutting edge technologies and capabilities over the 2 days of the exhibition.
Come and visit stand N401 and see this process and follow it step by step with an introduction to all the machines and consumables used along the line – and once the process is complete, visitors are invited to take away their own PCB.
Europlacer’s iineo will feature as an essential part of the Future Proof Assembly Line and will be used to place devices ranging from 01005 through to Package on Package (PoP).
The striking iineo platform features many improvements to the Europlacer machine range such as a higher feeder count, increased board size and increased maximum component height. The platform uses the company's proven core features: turret head, intelligent feeders, powerful software, while introducing new technologies with linear motors and digital cameras.
Europlacer’s iineo is widely configurable, allowing for numerous different possibilities:
• Single or dual linear motor gantry including a rotary turret head with eight or 12 pickups
• One or two board positioning mechanisms
• Oversized board options
• Huge feeder capacity to front and rear, or front only
The single-head iineo can handle maximum 460 x 700mm with options to handle up to 600 x 1610mm.
The double-head system can handle maximum PCB sizes 460 x 500mm with options to handle up to 600 x 1610mm. Both the single and dual-head iineo systems can handle minimum PCB sizes of 60mm2, board thickness of 0.5mm to 10mm and a maximum PCB weight of 10 kg.
The platform uses Europlacer’s unique Integrated IntelligenceTM plus proven core features;
• highly robust and flexible turret head
• intelligent feeders
• powerful software tools
while introducing new technologies with linear motors and digital cameras.
For more information, visit Europlacer’s Web site at www.europlacer.com
SEHO North America, Inc. will highlight its PowerSelective at the upcoming SMTA Atlanta Expo & Tech Forum, scheduled to take place Thursday, April 21, 2011 at the Gwinnett Civic Center in Duluth, GA.
SEHO’s PowerSelective features a modular design, ensuring the highest flexibility. The system offers SEHO’s unique multi-nozzle technology and can be customized to meet specific production requirements. The SEHO multi-nozzle technology ensures short cycle times as low as 25 seconds per panel or carrier. With tool change on-the-fly, customers can run high-mix production without losing changeover time.
For maximum flexibility, the system features high-precision mini-wave processes that are completely independent from the fluxing and preheat process to ensure high-volume production. Both multi-nozzle and mini-wave processes as well as conventional wave soldering processes can be performed with only one machine. Fiducial recognition, the simple-to-use offline teach program, and a comprehensive range of process control functions are only a few of the unique features that SEHO’s PowerSelective offers.
The new award-winning high-precision flux control not only monitors the function of the drop jet fluxer, but also controls the actual flux quantity applied to each solder joint. This ensures highest process reliability and constant process conditions without influencing cycle time. Another new feature is intelligent tool management, which automatically recognizes incoming boards and allocates them to the soldering unit that is equipped with the corresponding solder nozzle tool.
Depending on the application, the PowerSelective may be equipped with an inline conveyor for integration into a fully automated production line or with a batch conveyor module for standalone operation. The system is capable of handling multiple boards with parallel processes to minimize cycle times. Both bare boards as well as assemblies in carriers may be processed with the PowerSelective.
Product literature also will be distributed for all SEHO Systems’ products.
For more information about SEHO’s full product line, visit company representatives at the SMTA Atlanta Expo & Tech Forum or visit www.sehona.com
Acculogic’s Manufacturing Test Systems Division, a global leader in electronics test production solutions announces that its FLS940Sxi has been selected for inclusion in The Innovative Technology Center (ITC) at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Assessed by a review board of industry experts, the FLS940Sxi was selected based on its representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.
Acculogic’s FLS940Sxi is a lower cost solution to the already powerful Scorpion Flying Probe Tester line. In addition to its no-compromise single-sided test capability, the system can be equipped with up to 10 variable or fixed-angle probe modules. The FLS 940Sxi offers multi-probe (up-to 11) testing with variable angles as well ScanProbeTM Technology, which facilitates Boundary Scan (JTAG) and digital testing on any flying probe.
The Innovative Technology Center will feature products and services at the show that represent new or emerging technology with real, relevant value to the electronics manufacturing supply chain for printed circuit board design, fabrication, assembly or test. The display will be located in the Bayside Foyer outside of the exhibit hall.
For more information about Acculogic’s FLS940Sxi, visit Booth #1435 at the show or www.acculogic.com
A-Laser, a division of FCT Assembly and a premier laser cutting service specializing in the ablation of ultra-thin metals and plastics, has purchased a Keyence VHX-1000 Digital Microscope for its Milpitas, Calif. plant in an effort to further improve the company’s quality assurance capabilities.
“This piece of equipment takes our QA procedures to the next level, not only allowing us to take a closer look at every part we produce, but also to do so in a much more efficient manner,” commented Josh Saunders, A-Laser’s Regional Sales Manager.
The VHX-1000 not only integrates advanced functionality into a streamlined, all-in-one unit, but truly launches microscopy into the next generation. In the future, quick, accurate measurement and observation for the most challenging of targets will become a standard requirement for an observation system.
In one unit, the VHX-1000 encompasses a 17" LCD monitor and high-capacity HDD. This design enables use in every scenario from portable onsite observation to high-resolution image capture. This unit is heavily used in various areas including research, development, quality assurance and manufacturing.
A-Laser is committed to delivering precise, high-quality laser cut products. The addition of the Keyence VHX-1000 will enable A-Laser to provide the highest quality assurance for the precision and intricate design demands of today’s market.
For more information about A-Laser’s capabilities, visit www.a-laser.com
Engineered Conductive Materials, LLC, a leading global supplier of conductive interconnect materials for photovoltaic applications, will showcase its DB-1541-X Series Conductive Stringer Attach Adhesives in Hall A5, Stand 653 at the upcoming Intersolar Europe, scheduled to take place June 8-10, 2011 at the New Munich Trade Faire Centre in Munich, Germany.
The DB-1541-X Series of Conductive Stringer Attach Adhesives features optimized rheology for jet dispensing, and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. The material features a rubber-like flexibility that is ideal for flexible photovoltaic applications with high peel strength to withstand stresses induced in the reel-to-reel manufacturing process.
Company representatives will be available at the show to discuss Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.
Visit Hall A5, Stand 653 at Intersolar Europe to view Engineered Conductive Materials’ jet dispensing video and to learn how the company can define, develop and create an engineered material solution that is right for your company.
With the MSC Q7-NT2, MSC Vertriebs GmbH presents its first ARM® processor based Qseven™ module. The compact module consumes only 5 W typical and is specified for an extended ambient temperature range from -40 degree C to +85 degree C. The excellent graphics performance of the embedded module allows playback of HD videos and is, among other applications, ideally suited for digital signage.
Microsoft® Windows CE operating system and support for the open source, free Linux is currently offered for the Qseven(TM) module MSC Q7-NT2. In future, other alternatives will be available since Microsoft® recently announced that the next Windows® version will also support the ARM architecture in addition to Intel’s x86 processors.
The high-performance Qseven(TM) module MSC Q7-NT2 is based on the NVIDIA Tegra(TM) 290 low-power processor with dual core ARM Cortex A9, which is clocked with up to 1 GHz. The ARM/RISC processor architecture is supported by the Qseven(TM) Specification starting with Revision 1.20, which was released in September of 2010. Up to 1 GB DDR2 SDRAM and a NAND flash memory with a maximum capacity of 8 GB are integrated on the module.
The onboard ultra low-power 3D graphics controller GeForce OpenGL ES 2.0 offers a full HD resolution with 1920 x 1080 pixels. The graphics controller supports MPEG4/H.264 video encoding (D1) and decoding (Full HD). The HDM 1.3I interface and a second dual channel LVDS interface allow the connection of two large-scale displays. A camera can also be connected via the 1x 8-bit BT.656 video input available on the feature connector.
Thanks to its special graphics functionality, the Qseven(TM) module MSC Q7-NT2 is designed particularly for visualization applications, for example, in the medical sector and for image processing tasks. Demanding digital signage, multimedia, entertainment and Internet TV systems can also be implemented with the module. Furthermore, due to the extended temperature range, the platform is also perfect for use in industrial applications in harsh environments and transportation applications.
The Qseven(TM) module MSC Q7-NT2 offers three PCI Express(TM) x 1 channels, up to four USB 2.0 hosts, an USB OTG port, a serial UART interface, AC 97 audio, 10/100/1000 Base-T Fast Ethernet (IEEE1588 Real Time), I2C (400Kbit/s) and SPI. The SD/SDIO/MMC interface allows the connection of memory cards. The application data can be stored via two SATA II channels.
At Mobile World Congress 2011, Maxim Integrated Products demonstrated the MAX11855 and MAX11871, projected capacitive touch-screen controllers offering 4-point and 10-point touch detection with industry-leading sensitivity and noise immunity performance.
Building on the Company’s reputation for differentiated analog and mixed-signal performance, Maxim’s TacTouch family of capacitive touch-screen controllers addresses the various performance and price points demanded by OEMs. The latest TacTouch products offer superior sensitivity and noise immunity, making them the only devices capable of touch detection from a ballpoint/stylus and gloved hands.
Bart DeCanne, business director for application-specific data converters at Maxim, remarked: “We recently started sampling the MAX11871, and customer feedback has been unanimous: this part presents a sea change in capacitive touch performance. Finally, touch through gloves, with long fingernails, and with a stylus is possible. These capabilities will enable a range of new user-interface experiences on handsets, tablets, and other end equipment, providing a superior level of differentiation to Maxim’s customers.”
Industry’s highest sensitivity opens up new applications
The MAX11871 is a mutual capacitance touch-screen controller capable of detecting and tracking up to 10-finger simultaneous touch. All processing is included on-chip to output up to 10 X,Y touch location coordinates, with a Z pressure metric associated to each touch point, via a standard I2C interface to a host microcontroller. The part’s analog front-end is built from the ground up for capacitive touch by the Company’s high-resolution data-converter IC design team, and provides near 60dB signal-to-noise ratio (SNR) performance, equivalent to a 1000:1 ratio between touch and no-touch. This is an order of magnitude (10x!) higher than other solutions on the market today.
The excellent SNR enables detection of very weak (in the femto-farad range) touch variations, such as from a hand waving near the screen (proximity detection), touch from a fine-tip stylus or ballpoint pen, or a hand covered by a glove. Also, it means that the touch point can be farther away from the sensor, enabling touch screens with thicker cover glass or plastic for improved ruggedness.
The MAX11871 also includes a proprietary architecture to reject noise (by over 40dB) from external sources such as AC USB chargers, LCDs, or CFL lights with no additional external components. This selectivity enables the part to be used in high LCD noise environments such as next-generation on-cell and in-cell touch screens.
For applications only requiring 4-point touch detection, the MAX11855/MAX11856 implement a 4-finger simultaneous mutual capacitive multitouch solution, which eliminates any ghosting effect.
The TacTouch advantage: easily add haptic feedback to any end application
As part of Maxim’s TacTouch product line of haptics and touch-screen controllers, the MAX11871 and MAX11855/MAX11856 can directly interface to the previously introduced MAX11835/MAX11836 haptic controllers/drivers for piezo actuators and electro-active polymers. In comparison to classic low-voltage motors, these high-voltage actuators provide a superior touch feeling (i.e., they mimic the feeling of a button click on a touch screen). The two-chip touch and haptic controller chipset provides complete support for touch applications that “touch you back,” including support for region- and pressure-dependent haptics.
The MAX11871 comes in a 6mm x 6mm 48-pin TQFN package with 32 cap-sense channels. A wafer-level package (WLP) option is planned for designs requiring an ultra-small footprint. The MAX11855 comes in a 5mm x 5mm 40-pin TQFN package with 25 cap-sense channels, typically sufficient for panels up to ~4in. The MAX11856 provides 31 cap-sense channels in a 6mm x 6mm 48-pin TQFN package, making it suitable for panels up to ~7in depending on required touch accuracy. With on-chip clock oscillator and voltage references, all parts only require a few passives as external BOM.
All parts are sampling now for qualified opportunities. Evaluation kits are available. Mass production is scheduled to begin before the end of Q1 CY2011.
National Semiconductor Corp. announced the industry’s first stereo analog subsystem with integrated Class G headphone amplifier and automatic level control (ALC) for smartphones and feature phones. The PowerWise® LM49251’s Class G headphone amp dynamically reduces the supply voltage to lower power consumption and extend audio (MP3, movies, etc.) playback time. The loudspeaker’s ALC provides designers with several options to control audio distortion levels and prevent speaker damage.
National’s LM49251 stereo analog subsystem combines a 1.4W Class D speaker amplifier, 20 mW Class G headphone amplifier and ALC in an ultra-small 2.55 mm by 3.02 mm package. The LM49251 offers the lowest power consumption in its class, consuming less than 7 mA of quiescent current at 3.3V for the loudspeaker and headphone. The LM49251’s ALC feature provides designers with a programmable output power limiter for speaker protection and clip level select.
Key Technical Features – LM49251 Stereo Analog Subsystem
Offered in a 30-bump micro SMD package, the LM49251 provides enhanced Emission Suppression (E2S) and a Class D amplifier featuring a patented, ultra-low EMI pulse-width modulation (PWM) architecture that significantly reduces RF emissions while preserving audio quality. The LM49251’s Class G headphone architecture significantly increases audio playback time with its adaptive power supply approach, enabling very low supply rails and nearly doubling the power-efficiency compared to typical Class AB headphone amplifiers.
The LM49251’s no-clip ALC feature prevents distortion as battery voltages drop, allowing small signals to be amplified at high gains while preventing clipping of high-level signals. Its multiple inputs provide configurability for addressing different system requirements, and the LM49251’s mode selection, shutdown and volume are controlled through an I2C compatible interface. The IC’s click-and-pop suppression eliminates audible transients on power up and during shutdown.
National also introduced the LM49153 mono audio subsystem, which includes the same features as the LM49251, while integrating noise gate functionality onto the Class D amplifier. The noise gate feature prevents noise from being amplified when the volume is turned up. The LM49153 is offered in a 25-bump, 2.30 mm by 2.42 mm, micro SMD package.
Pricing and Availability
Available now, the LM49251 stereo analog subsystem is priced at $1.60 each, and the LM49153 mono analog subsystem is priced at $1.50 each, both in 1,000-unit quantities. For more information on the LM49251, or to order samples, visit www.national.com/pf/LM/LM49251.html
For more information on the LM49153, or to order samples, visit www.national.com/pf/LM/LM49153.html
Kontron announced several additions to its VPX/OpenVPX ecosystem including the Kontron 3U VPX PCI Express and Ethernet hybrid switch VX3905, the Kontron 3U FMC carrier board VX3830, the Kontron 3U XMC/PMC carrier board VX3800 as well as OpenVPX backplanes. With these building blocks, alongside of the new VXFabric IP socket API for data management, Kontron provides a comprehensive VPX ecosystem.
The focus of these additions to Kontron’s VPX/OpenVPX ecosystem surrounds the optimization of the data plane in VPX/OpenVPX multiprocessor systems and to relieve OEMs and developers from the complex, low level hardware and data management. This helps OEMs take existing or new HPEC applications to a new level of performance and bandwidth with reduced development efforts and R&D costs.
"After the successful launch of processor boards and switches, we now round off our VPX/OpenVPX ecosystem with hardware and software for the complex task of efficient data flow management in multiprocessor based HPEC systems. We provide a complete system platform solution based on modular building blocks from one location, including pre-validated customizable COTS hardware, comprehensive software and integration services for customers system-level solutions. All this is based on products that offer highest compatibility, reliability and longest product life cycles by design and is complemented by Kontron’s specific Long Term Supply service for highest design security of current and upcoming longlife applications”, explains Vincent Chuffart, Product Manager at Kontron.
Kontron OpenVPX backplanes
The Kontron OpenVPX backplanes are compliant to the VITA 46.4 specification and provide a high bandwidth PCI Express architecture for the data plane. They are available with a distributed or centralized configuration and enable OEMs to set up nearly all possible system topologies. The distributed backplanes come in a 3-, 4- or 5-slot configuration. The centralized backplane features six payload slots and two switch or storage slots with Gigabit Ethernet on the Control Plane. All VPX boards can be used with these backplanes, including the powerful Kontron 6U VPX dual CPU board VX6060. This approach, allowed by the VPX mechanical standard, provides superior computing power while keeping VPX infrastructure cost as low as possible.
Kontron 3U VPX PCI Express and Ethernet hybrid switch VX3905
The Kontron 3U VPX PCI Express and Ethernet hybrid switch VX3905 is the ideal partner for the centralized backplane to efficiently handle a high bandwidth. It provides up to 24 Ports with 32 lane PCI Express Gen 1 / Gen 2 switching and additional 9 port gigabit Ethernet switching capabilities for the control plane. By this it offers a tenfold increase in I/O bandwidth between computing boards in High Performance Embedded Computing applications compared to VME, unleashing a new kind of applications for data processing platforms used for Radar, Sonar and general image processing.
Kontron 3U FMC carrier board VX3830 and 3U XMC/PMC carrier board VX3800
With the Kontron VX3830 and VX3800 OEMs can easily expand the I/O flexibility of their dedicated VPX systems. The Kontron 3U FPGA Mezzanine Card (FMC) carrier board VX3830 is based on a Xilinx Virtex-5 FPGA and offers enhanced I/O capabilities with high integrated performance logic. The Kontron 3U XMC/PMC carrier board VX3800 is designed to support any standard XMC/PMC mezzanines. It provides one XMC/PMC site, alternately used as a PCIbus 32-bit/66 MHz or as an XMC site with either a x4 or a x1 PCI-Express link to the VPX backplane.
As the hardware environment is set, OEMs need an efficient solution for inter-board communication. The Kontron VXFabric simplifies this task for VPX/OpenVPX system architectures by a set of ready to use libraries and kernel modules. The highest level of communication bandwidth is achieved through classic Linux and TCP or UDP sockets based on PCI Express physical layer. By decoupling the application software from the low-level silicon management, Kontron VXFabric not only simplifies and accelerates application development but also helps to extend application lifecycles, as it enables migration to upcoming communication standards such as 10G and 40G ETH for the backplane.
Kontron’s VPX/OpenVPX ecosystem for developing high-performance and SWaP (Size, Weight and Power) optimized systems, now features all core components and software for a direct start into system development. All Kontron VPX/OpenVPX platforms are available either as standard off the shelf solutions or can be customized to application specific requirements. Through this service, Kontron helps OEMs to speed up their time-to-market and increase overall quality of applications.
As a member of the OpenVPX Industry Working Group, Kontron took an active part in developing the OpenVPX (VITA65) specification, which defines system level VPX interoperability for multivendor, multi-module, integrated system environments. All Kontron VPX products are 100 percent compliant to the OpenVPX specification for highest interoperability, optimizing time to market and total cost of ownership.
Download the whitepaper about Kontron VXFabric here: http://www.kontron.com/VXFabric
For more information on the Kontron 3U VPX PCI Express and Ethernet hybrid Switch VX3905, please visit: http://www.kontron.com/products/boards+and+mezzanines/3u+vpx/switch/vx3905.html
MSC now offers eight new ultra low power 32-bit MCUs in the V850ES/Jx3-L series from Renesas Electronics. These devices are especially suited to mobile smart metering and medical applications with high memory demand.
The typical current consumption of the MCUs with up to 1 MB flash memory and 80 KB of RAM is only 14 mA and the standby current 1.5 µA. Furthermore, four of the new V850ES/Jx3-L devices, designed for clock frequencies from 2.5 MHz to 20 MHz, are available with a USB 2.0 Full Speed communication interface, which, among other things, supports simple data exchange in healthcare systems according to the Continua Alliance standard.
For fast and easy evaluation, among other things, MSC provides a free V850ES/Jx3-L low power USB stick demonstrator to developers upon request. With the help of this kit, which is based on a V850ES/JG3-L MCU with 512 KB flash memory, the different standby modes can be tested. The kit supports current consumption measurement with use of an ampere meter. It also demonstrates RAM retention and real time clock operation in the lowest power mode.
As additional development support, MSC provides a QB-V850ESJG3LUSB-TB target board, which is optimized for use with a MiniCube2 debugger, the QB-MINI2-EA.
Data sheets, samples and the free V850ES/Jx3-L low power USB stick demonstrator can be requested by contacting micros-renesas@msc-ge.
Silicon Laboratories Inc., a leader in high-performance, analog-intensive, mixed-signal ICs, and IMST GmbH, a leading supplier of wireless communications technology, introduced a turnkey wireless M-Bus solution designed for the smart energy market. The comprehensive hardware/software solution combines IMST’s industry-leading expertise in the wireless M-Bus market with Silicon Labs’ Si10xx wireless microcontroller (MCU) technology to simplify the deployment of ultra-low-power, high-performance, pre-certified wireless M-Bus modules for smart meters.
IMST’s iM871A wireless M-Bus module offers a cost-effective RF solution for smart metering applications connecting water, heat, electricity and gas meters with data concentrators in the 868 MHz frequency band. Using Silicon Labs’ high-performance Si1002 wireless MCU, the iM871A module can achieve a link budget up to 120 dB when operating in R2 mode, resulting in exceptional RF range and communications performance. This link budget is especially critical in addressing wireless communication requirements in challenging environments inside residential and commercial buildings.
The iM871A module has an exceptionally small footprint (17 mm x 19 mm), comes equipped with a serial interface as well as analog and digital inputs and outputs to accommodate interfaces with a customer’s system, and is fully compliant with the EN 13757-4 standard. With a standby current of less than 1 microamp, the iM871A is well-suited for applications requiring long battery life such as water and gas meters. The iM871A module solution is compatible with a wide range of wireless M-Bus devices in the field. The module supports all major unidirectional and bidirectional wireless M-Bus modes (S1, S2, T1, T2 and R2) in addition to all tolerance specifications, enabling the highest possible flexibility in metering environments.
“The collaboration between Silicon Labs and IMST has resulted in a best-in-class, sub-GHz wireless M-Bus solution that combines one of the industry’s lowest power wireless MCU with the proven performance of IMST’s wireless M-Bus software,” said Dr. Peter Waldow, CEO of IMST. “The jointly developed wireless module will streamline the development of cost-effective and energy-efficient wireless M-Bus solutions required in today’s smart meter market.”
As a member of Silicon Labs’ Wireless Partner Program, IMST has the expertise to provide comprehensive design services and support. IMST’s in-house test lab also can cover certification measurements required by manufacturers of end products.
“The combination of Silicon Labs’ Si10xx wireless MCUs and IMST’s wireless M-Bus module provides an ideal sub-GHz wireless communications solution for today’s smart energy applications,” said Mark Thompson, vice president of Embedded Mixed-Signal products at Silicon Labs. “Using this tightly integrated hardware/software solution, embedded developers can get their wireless M-Bus applications up and running quickly while benefiting from the power-efficient, battery-saving capabilities of our Si10xx MCUs and their exceptional wireless range and performance.”
About the Silicon Labs Si1000 Wireless MCU
The Si10xx wireless MCU family combines a 25 MHz 8051 core, EZRadioPRO® sub-GHz RF transceiver, 64 kB of flash and a 10-bit ADC – all in a compact 5 mm x 7 mm package. The Si10xx family’s integrated power and low-noise amplifiers enable an extended RF range, high bandwidth and ultra-low power consumption. The industry’s most power-efficient wireless MCU solution, the Si10xx family provides the lowest active-mode current consumption (160 microamps per MHz). In sleep mode, the wireless MCUs consume only 315 nanoamps using the internal low frequency RTC. In deep-sleep mode, they can operate on as little as 25 nA with full RAM retention.
Pricing and Availability
The Si10xx MCU-based iM871A wireless M-Bus module is being demonstrated today at Embedded World 2011 in Nuremburg, Germany, Mar. 1-3 at Stand 12-136 and Stand 12-277. Priced at $14 USD in 10,000-unit quantities, the iM871A module is planned to be broadly available in Q2 2011.
For more information about the iM871A wireless M-Bus module or to order samples, visit www.wireless-solutions.de
For more information about Silicon Labs’ Si10xx wireless MCU family or to purchase samples and development tools, visit www.silabs.com/pr/wirelessmcu
Kontron expanded its VPX ecosystem with the new Kontron 3U VPX CPU board VX3035 based on the 2nd generation Intel Core i7 processor. Integrating the Intel Core i7 2655LE processor, Intel HD graphics and features such as Intel Turbo Boost technology and Intel Advanced Vector Extensions (Intel AVX), the new 3U VPX CPU board defines a new performance class for SWaP (size, weight and power) optimized high-performance embedded computing applications.
OEMs will benefit from the Kontron 3U VPX CPU board VX3035 due to its outstanding versatility and x86 technology, coupled with high vectorial and parallel computing power. System developers can develop extremely compact and light applications with high parallel computing power, such as video and image processing, radar, sonar or signal processing in software-defined wireless equipment. The new VPX board also supports established APIs such as Open CL, which simplifies and speeds up application development. With the support of Kontron VXFabric, the new CPU board facilitates inter-board communication in VPX/OpenVPX designs, since the socket interface standardizes inter-board communication. By decoupling the application software from the low-level silicon management via a set of ready-to-use libraries and kernel modules, the Kontron VX3035 and Kontron VXFabric further simplify and accelerate application development.
In connection with Kontron’s long-term supply program, the new Kontron 3U VPX CPU board VX3035 is predestined for the most varied long-term projects in the areas of defense technology, aviation and all other markets that rely on long-term available, rugged COTS platforms. In addition, the Kontron VX3035 is designed as a drop-in replacement of the Kontron VX3030 based on the Intel Core i7 processors 620 LE or 610E, which can be ordered for serial production. Developers can start directly with the development and delivery of their applications and later upgrade to the second-generation platform. This helps OEMs to significantly reduce their time-to-market and increase the availability of their applications. Like all Kontron VPX products, the Kontron VX3035 is compliant with the OpenVPX specification (VITA 65).
The Kontron VX3035 in detail
The Kontron 3U VPX CPU board VX3035 is based on the highly integrated and extremely energy-efficient Intel Core i7 2655LE processor with integrated Intel HD graphics and the Intel QM67 controller hub. This CPU architecture will also be available as a 6U VPX dual CPU solution. It supports up to 8 GB dual channel 1333 SDRAM with ECC and is available in three designs: standard air-cooled (0 degree C to + 55 degree C), rugged air-cooled (-40 degree C to + 70 degree C) or rugged conduction-cooled (-40 degree C to +85 degree C) for extreme environmental conditions. Customers can adapt the board exactly to the ambient conditions and benefit from an optimized total cost of ownership, regardless of the demanding conditions.
In addition, the Kontron VX3035 and the Kontron VX3030 integrate an extensive range of interfaces. On the backplane, along with PCI Express x4 (configurable via software also to 4x PCIe x1), it also implements 4x SATA II, 3x Gigabit Ethernet, 4x USB 2.0 and two serial interfaces (EIA232/EIA485). On the front panel, 1x Gigabit Ethernet, 1x USB 2.0 and a serial port are available, along with a VGA output. An on-board USB/SATA connection offers support for standard USB/SATA FlashDisk modules. On the lower side, a PCIe x1 interface allows expansion with application-specific I/O mezzanines.
The Kontron 3U VPX CPU board VX3035 supports Windows Embedded Standard 7, Linux as well as VxWorks. For rapid prototyping and software development, Kontron will soon offer the EZ3-VX3035, a turn-key 3U VPX system based on the new Kontron VX3035. OEMs and system developers benefit from a flexible and simple system build that requires no hardware skills. With these development tools, application developers can concentrate on their core competencies to improve time-to-market and application quality.
For further information on the Kontron 3U VPX CPU board VX3035 please visit:
Ericsson Power Modules has been chosen as a finalist in EDN magazine’s prestigious “Innovation Awards” for 2010. Power Modules’ entry cleverly combines the technical excellence of its ‘3E’ series BMR454 DC/DC converter with the benefits of Dynamic Bus Voltage (DBV). DBV delivers the ability to adjust the level of the bus voltage to suit varying load conditions, further maximising power system efficiency.
The annual EDN Innovation Awards honor outstanding engineering professionals and products. The awards carry special meaning because a jury of their peers chooses the winners. First, EDN accepts nominations from the industry via its web site. Next, working in panels organized by areas of expertise, EDN’s technical editors select the most deserving nominees as finalists. On February 17th, EDN published the names of the finalists and information about them both in print and on the magazine’s web site. EDN then invited its worldwide audience of engineers and engineering managers to vote using an online ballot. EDN uses a combination of these audience votes, balloting by the EDN Editorial Advisory Board, and voting by EDN’s editorial staff to determine the ultimate winners.
"It is very apt that Ericsson Power Modules has achieved finalist status in the power supplies category of EDN’s Innovation Awards for a product that is so innovative. It is also a strong sign that digital power technology, originally introduced by Ericsson in 2008, is recognized worldwide as leading edge technology to power ICT applications," said Patrick Le Fèvre - Marketing and Communication Director at Ericsson Power Modules. "Historically we have been very successful at winning industry awards – including an EDN Innovation Award - and I’m excited at the prospect of repeating that performance."
Delivering as much as 240W with 95% efficiency, Ericsson Power Modules’ BMR454 DC/DC converter family offers double the power of most eighth-brick modules that offer isolated, tightly-regulated output voltages. Fully capable of standalone operation to suit traditional intermediate-bus and DC/DC regulator applications, these modules convert 36 – 75VDC power to 3.3/5/9/12V output levels with ±2% regulation. In a first for the industry, the modules include a PMBus interface and power-management subsystem that allows users to monitor and adjust numerous operating parameters in real time. This makes it easy to construct systems that actively manage power conversion to optimize their performance across a very wide range of loads.
Factors driving the demand for this type of product are the need for increased performance levels embracing lower power consumption, reduced heat generated by power conversion stages, reduced environmental impact and total cost of ownership, and forthcoming regulations requiring energy data measurement.
Kontron announced today the world’s first Computer-on-Module in the space-saving COM Express compact form factor, the Kontron microETXexpress-OH based on the new energy-efficient and highly integrated AMD Embedded G-Series Accelerated Processing Units (APUs). Integrating a powerful parallel processing and graphics unit, in addition to the processor, this strikingly small Computer-on-Module stands apart because of its extremely high graphics performance as compared to other modules offered in a compact footprint.
With DirectX 11 and OpenGL 3.2 support, integrated Unified Video Decoder (UVD 3.0) and long-term availability, the Kontron COM Express compact Computer-on-Module microETXexpress-OH is an exceptional solution for SFF applications that require high-performance, high-speed graphics to produce fluid, high-resolution image and video displays. In addition to gaming and Kiosk POS/POI systems, these applications include large display panels, multimedia walls, professional AV equipment, as well as small-sized mobile devices such as test & measurement systems or mobile 3D ultrasound scanners and imaging systems used in medical or automation. Supporting OpenCL and Microsoft DirectCompute, the graphics unit of Kontron's microETXexpress-OH also accelerates parallel processing tasks for solutions that are designed to process parallel vector algorithms. Sample applications include mobile ultrasound devices, video surveillance with pattern recognition, laser detection systems, tracking systems, encryption and decryption systems in data communication as well as signal processing in software-defined wireless equipment.
Enhanced by the type 6 COM Express pin-out, the Kontron COM Express compact Computer-on-Module microETXexpress-OH has a variety of graphics interfaces making it well-suited for applications running multiple screens simultaneously. In addition to LVDS and VGA, the module has three digital display interfaces (DDI) through which developers can implement DisplayPort, HDMI, and DVI. Because the Kontron microETXexpress-OH natively supports of all the video interfaces in current use, developers also benefit from simplified application design, cutting both time-to-market and total cost of ownership. An additional benefit of the Kontron microETXexpress-OH is super-speed USB 3.0 support over the type 6 pin-out. Two USB 3.0 ports allow connection of the most modern peripheral components such as full HD video cameras or fast external storage media which facilitates building small machine vision systems with commercially available standard components, as an example.
The feature set in detail
The Kontron microETXexpress-OH, based on the COM Express type 6 pin-out, is scalable in four stages over the bandwidth of the AMD Embedded G series APUs: from the 1.2 GHz T44R single-core APU with 512 kb cache and AMD Radeon HD6250 GPU up to the 1.6 GHz dual-core variant T56N with AMD Radeon HD6310 and 2 x 512 kb cache. Thanks to this broad performance range, OEMs can adjust performance and energy consumption to the respective application requirements.
The Kontron microETXexpress-OH connects up to 8 Gbytes of DDR3 RAM via two memory sockets. Compliant with the new COM Express specification, COM.0 rev. 2.0, it implements 6x PCI Express x1 lanes Gen 2.0, 4x SATA 3, Gigabit Ethernet, and 6x USB 2.0. Additionally, two superspeed USB 3.0 ports deliver gross data rates that are more than ten times higher compared to USB 2.0 with up to 5 Gbits/s (625 Mbytes/s) in SuperSpeed mode.
For video interfaces, along with VGA and LVDS, the new COM Express compact module also offers DisplayPort and DVI/HDMI 2x each for quick and flexible connection of all monitor types currently available on the market. Altogether two independent displays can be activated. And with the integrated universal video decoder 3.0, the new Kontron microETXexpress-OH sets a new benchmark for multimedia systems. It can decode both 1080p BluRay videos with HDCP and HD MPEG-2 and DivX (MPEG-4) videos with minimal CPU load.
The new Kontron COM Express compact Computer-on-Module microETXexpress-OH supports the Windows OS and Linux. Additional BSPs will be available from Kontron in the near future.
For more information on the Kontron COM Express compact Computer-on-Module microETXexpress-OH, please visit:
Amplicon’s Industrial Computing division has released the Impact-E 70 series, their next generation of rugged fanless embedded systems. The range combines high performance Intel i5 and i7 class processors within a compact, and virtually maintenance free system.
The Impact-E 72 and Impact-E 73 are the newest models in the Amplicon Impact-E rugged embedded system range; taking fanless performance to the next level by providing a processing performance of up to 3 times faster than previous models within the same range, making them ideal for today’s cutting edge industrial applications.
The newly released systems are available with a scalable range of Intel mobile 32nm processors ranging from the entry level 1.86GHz Celeron, to the flagship 2.66GHz Core i7. All processors are selected from Intel’s embedded roadmap thereby guaranteeing long term availability, and has DDR3 memory fitted as standard to further enhance the performance of the systems
Housed within a rugged aluminium enclosure, when equipped with the solid state drive option the system is extremely resistant to shock and vibration; it also features a wide operating temperature and voltage input, making the system a versatile choice for a range of harsh environments.
Remote system management is provided by Intel iAMT. The system can be interrogated, reset, power-cycled or a full system recovery undertaken across a network connection. Together with an Amplicon wireless solution, systems can be deployed at remote locations allowing them to be fully serviced remotely, negating costly site visits.
Despite the compact form-factor the system features an exceptional range of expansion and interface support, with dual eSATA for high bandwidth connectivity to external storage, dual gigabit Ethernet, versatile I/O with 4 Com Ports, 4 x GPIO and options for dual PCI and PCI / PCIe expansion card options.
‘We are very excited by the Impact E-70 series, it provides a level of processing performance not previously seen in fanless embedded systems, and is equipped with a range of features to suit a wide variety of mobile and industrial applications‘ commented Richard Cobden, Amplicon Engineering Manager.
For further details please visit: http://www.amplicon.com/IPC/info/impact-e70-series.cfm