News from june 2010

Electronics Components

Extended HDMKP Series of Heavy-Duty Capacitors

June 29, 2010

Vishay Intertechnology, Inc. is extending its heavy-duty Vishay ESTA HDMKP capacitors for power electronics with new capacitance and packaging options.
HDMKP capacitors are available in six standard voltages from 900V to 2700V (dc). Previously offering capacitance values from 40 µF to 1100 µF, the series has now been extended to offer capacitance values up to 2235 µF, with a capacitance tolerance of ±5%.
The HDMKP capacitors are aimed at dc and ac filtering and dc linking applications in power converters for uninterruptible power supplies, wind turbines, and in power converters for traction and industrial drives. They will also serve as impulse discharge capacitors for magnetizing and welding.
The metallized-film HDMKP capacitors feature current ratings as high as 150A, high impulse current of up to 25kA, and low self-inductance of less than 70nH.
In addition to their exceptionally low inductance and high current ratings, the HDMKP capacitors offer extremely low losses at high frequencies, low ESR, and high resistance to the effects of shock and vibration for high reliability and life expectancy in rugged environments.
In addition to new capacitance ratings, the series is gaining a new case option for a total of four. Capacitor height options range from 105mm to 260mm, with diameters of 84.4mm and 116mm. The devices feature a non-polar dielectric and are easily mounted using an integrated M 12 stud on their base.
Devices in the HDMKP series are specified for an operating temperature of -40°C to +70°C at full rated voltage, or up to +100°C at half of the rated voltage, and meet IEC 61071 1, EN 61071, IEC 68 2, and IEC 61881 standards. Terminal-to-terminal test voltage is 1.5 times the rated dc voltage for 10 seconds.
Samples and production quantities of the HDMKP series capacitors are available now, with lead times of 8 to 10 weeks. Follow Vishay ESTA heavy duty capacitors at

Vishay Introduces New VOM452T and VOM453T High-Speed, 1 MBd Optocouplers in Compact SOP-5 Package

June 29, 2010

Vishay Intertechnology, Inc. is broadening its optoelectronics portfolio with the release of two high-speed analog optocouplers in the industry-standard SOP-5 package, saving up to 75 % in PCB space compared to a DIP-8 SMD package. The new VOM452T and VOM453T feature a baud rate of 1 MBd in a low-profile package with a height of 2.0 mm. They also feature a very short propagation delay of 1 µs which is critical for applications requiring faster switching times than standard phototransistor optocouplers.
The VOM452T and VOM453T 1 MBd optocouplers will be used for signal isolation in industrial communication bus lines, such as CANbus, CC-Link, and other serial interfaces. On one side of the bus line, they are connected to programmable logic controllers (PLCs) or automation controllers, which have an operator interface, and on the other side, they are connected to sensors on electrically noisy factory floors. The optocouplers protect operators from electrical shocks and protect the microprocessor within the PLC from being damaged by voltage spikes. The compact SOP-5 package is capable of providing 3750VRMS of voltage isolation. The VOM452T is rated for 1 kV/µs common mode noise immunity while the VOM453T is rated for 15 kV/µs.
Samples and production quantities of the new VOM452T and VOM453T are available now, with lead times of six to eight weeks for large orders.

New VLSL30 and VLSL31 24-LED Light Panels and Development Kit

June 29, 2010

Optional Development Kits Include Lighting Panel, 2 x 24-W Driver, and Reflectors
Vishay Intertechnology, Inc. (NYSE: VSH) is broadening its optoelectronics portfolio with new LED light panels for streetlight and industrial overhead lighting applications. The panels double as the core of a development kit that gives designers everything they need to get up to speed designing with Vishay's solid-state lighting solutions.
In addition to the 4 x 6 LED panel, the kit includes reflectors and a driver module, providing the basic tools designers need to avoid development delays and focus on getting lighting products to market quickly, while adopting energy-efficient, environmentally friendly, long-lifetime LED lighting technology.
Two panel options are available. The VLSL30 panel features cool white LEDs with a temperature range of 5000 K to 7000 K and a luminous flux of 2160 lumens. The VLSL31 panel features neutral white LEDs with a temperature range from 3800 K to 5000K and a luminous flux of 1900 lumens.
The VLSL30 and VLSL31 light panels consists of four strings of six LEDs mounted on a single-sided, single-layer, copper-based PCB. The copper base quickly conducts heat away from the LEDs, extending their operating performance and life, while the shiny white surface provides a small degree of reflectivity of incident light. The panel measures 135 mm by 121 mm.
The optional VLSL3-DU driver features output power up to 56 W and offers eight boost-regulated constant-current channels, each with six LEDs. The driver is designed to provide power to two light panels. It features reverse polarity protection, closed-loop regulated current control, and 12-VDC input with undervoltage and overvoltage control and load dump protection. Each panel can be programmed to respond to input from an ambient light sensor. Based on the ambient light level, the driver will adjust the pulse width modulation to one of four settings: 100 %, 75 %, 50 %, and 25 %. It also features an RS232 input for custom programming of the controller.
Aluminum alloy reflectors are also available to control the pattern of illumination. Without reflectors, the viewing angle of the VLSL30 and VLSL31 power modules or light panels is 120° in all directions. This viewing angle can be tightened in one direction to 55° with the use of the VLSL-REFL01 reflectors.
The panels, driver, and reflectors are sold separately or as a kit to simplify development. The VSL30-LDK features cool white LEDs while the VSL31-LDK features neutral white LEDs. Each kit comes with one light panel, five reflectors, and one driver.

Device Specifications Table:
Part number VLSL30 or VLSL30-LDK VLSL31 or VLSL31-LDK
Color Cool white Natural white
Temperature range (K) 5000 to 7000 3800 to 5000
Luminous flux (lm) 2160 1900
Technology InGaN InGaN
Link to LED Lighting Development Kit Product Overview:

Samples and production quantities of the LED light panels, driver, and reflectors are available with lead times of six to eight weeks. Follow Vishay solid-state lighting solutions at

Vishay Renews Hi-Rel Analog Switch and Multiplexer Product Line

June 29, 2010

Vishay Intertechnology, Inc. a longtime supplier of high-reliability discrete and IC components to military and aerospace customers, today announced that its Vishay Siliconix facility in Santa Clara, Calif., has been re-qualified by DSCC to manufacture analog switches and multiplexers with screening to MIL-PRF-38535. The MIL-PRF-38535 specification is a standard that establishes the performance, quality, and reliability requirements for IC components used in systems being built for hi-rel applications.
The first product to be manufactured under the new certification is a hi-rel version of the DG409, a dual four-channel differential analog multiplexer. The DG409 connects one of four differential inputs to a common dual output. It features a 44-V maximum supply rating, low on-resistance of 100 ohms, and low charge injection of 20 pC. Three military package options are available: the 16-pin CerDIP, the 20-pin LCC, and the 16-pin Flat-Pack. Additional hi-rel versions of analog switch and multiplexer products will be announced later in 2010.
The Vishay facility in Santa Clara also is in the process of becoming qualified for military MOSFETs. All Vishay Siliconix hi-rel MOSFETs and IC products are manufactured in the Santa Clara fab and conform to the most stringent reliability requirements in the industry. Vishay has long-term relationships with virtually all of the distributors serving hi-rel markets.
In addition to MIL-PRF-38535, Vishay Siliconix continues to offer source-controlled drawing capabilities to allow space-level screening.
Samples and production quantities of the hi-rel DG409 multiplexer are available now, with lead times of 20 weeks for larger orders. Follow Vishay analog switches and multiplexers at

Microchip Integrates and Simplifies Graphics on PIC24F Microcontrollers, Provides up to 96 KB RAM

June 14, 2010

- Fully integrated graphics acceleration hardware simplifies design and lowers system cost;
- Removes the need for external display controller or memory to drive large, colourful displays;
- Single-chip solution includes mTouchTM technology and a range of wired connectivity including USB, I2C and SPI.
Microchip announces the eight-member PIC24FJ256DA microcontroller family, which integrates three graphics acceleration units and a display controller, along with up to 96Kbytes of RAM. This integration reduces system costs and makes it practical to add advanced graphics displays for a wide range of embedded applications, by eliminating the need for external RAM and a display controller. Additional savings are achieved through the integrated peripherals for USB and capacitive touch sensing.
Microchip’s PIC24FJ256DA family makes it feasible for designers to migrate beyond fixed-function, segmented LCDs to STN, TFT and OLED displays with up to VGA resolution. This family also features 24 channels of on-chip mTouch™ capacitive touch sensing, which enable a large number of buttons, sliders and keys. Additionally, the integrated Full-Speed USB Embedded Host, Device and On-the-Go module allows end users to easily upgrade software, log data and customise settings.
Example applications for the PIC24FJ256DA family include: consumer (thermostats, cordless phones, remote controls, gaming accessories); home appliance (coffee makers, ovens, refrigerators, washing machines); industrial (points of sale, remote terminals); and portable medical (glucometers, blood-pressure monitors, portable ECGs).
To enable quick time to market, Microchip’s Graphics Display Design Centre provides a host of resources for application designers. This platform comprises Microchip’s free and performance-optimized Graphics Library, which comes with the full source code, supports multiple fonts and languages, and includes a host of pre-made graphics objects.
Complementing this Library is the free Graphics Display Designer software, which enables first-time users with a visual wizard for designing user interfaces. The Graphics Library also comes with pre-configured interfaces for capacitive-touch pads and sliders, and resistive touch screens. Rounding out this platform, Microchip created the PIC24FJ256DA210 Development Kit to enable out-of-the-box graphics development. This kit is available today for $399.99 (part No DV164039).

For more information, visit

Rutronik and Fujitsu expand cooperation to wireless modules

June 14, 2010

Rutronik Elektronische Bauelemente GmbH expands its portfolio to include wireless components from Fujitsu Components Europe B.V. Effective immediately, Rutronik will distribute GPS, WLAN and Bluetooth as well as combination modules with Bluetooth and WLAN support throughout Europe. They are available in SMD technology and plug-in design and are complemented by an external antenna. Rutronik and Fujitsu have been working together successfully for many years in the area of electromechanical components, semiconductors and PC components.
Recently, Fujitsu Components Europe B.V. integrated the wireless module product range from Fujitsu Media Devices into its program. Based on the long-standing partnership with Fujitsu, Rutronik will distribute the entire expanded product range throughout Europe. The profound wireless expertise of the distributor comes into play here: The Wireless Competence Centre with the combined knowledge of its field application engineers, product managers, line managers and business development managers, is available to Rutronik customers throughout Europe.
"The wireless modules from Fujitsu represent the ideal enhancement to our product range," explains Bernd Hantsche, Product Area Manager of the Wireless Competence Centre at Rutronik. "Fujitsu not only offers sophisticated wireless products, they also promote an interesting portfolio as well as years of experience in this sector. In addition, our customers can take advantage of our experience from the interaction of wireless technologies with microcontrollers and other components."
"The concept and the success of the Wireless Competence Centre in combination with the excellent technical and commercial customer support, which we experienced time and time again over the course of our current partnership with Rutronik, convinced us entirely," Dennis van Doorn, Account Manager Wireless Products at Fujitsu, explains. For this reason, the next logical step was to continue working together with Rutronik in the wireless segment.

Tensilica Expands Wireless Baseband Business Unit

June 14, 2010

Tensilica,® Inc. today announced that it has expanded its baseband business unit and hired Eric F. Dewannain as vice president and general manager. Dewannain was previously general manager of the custom ASIC business unit at Texas Instruments, Incorporated (TI) and, prior to this, general manager of the cable broadband communications business unit. Dewannain has extensive business experience in mobile wireless infrastructure and broadband communications.
Tensilica's customers have used the company's customizable dataplane processor (DPU) technology to design their own digital signal processors (DSPs) for the past 10 years. Two years ago, Tensilica formed its baseband business unit and has since enjoyed great success as the rising star in programmable baseband signal processing. Customers include Fujitsu, Huawei, NEC, Panasonic, and many other major undisclosed companies, all of whom are engaged in LTE (Long-Term Evolution) and 4G baseband chip design with Tensilica's DPUs and ConnX(TM) baseband DSPs. Tensilica's DPUs and ConnX baseband DSPs are ideal for baseband because they can be customized to provide greater power and performance efficiency than standard DSPs.
"Because of our solid DPU foundation and success in baseband signal processing, we've been able to ramp up quickly and add top engineering talent to our team," stated Jack Guedj, Tensilica's president and CEO. "Now, with Eric, we're reaching critical mass with strong leadership to help us continue our growth trajectory."
"It's exciting to join an aggressive company that's rapidly becoming the architecture of choice for programmable baseband signal processing," Dewannain stated. "The amazing thing is how fast we can develop new products and provide optimized solutions for the mobile wireless market using the same Xtensa(TM) DPU foundation and tools we license to our customers. Leveraging this strong Xtensa DPU foundation, Tensilica has been able to develop a comprehensive IP (intellectual property) suite tailored for LTE and introduce two generations of ConnX BBE baseband DSPs in less than two years. Any other IP vendor would take several years to develop these products."
Dewannain spent the last 18 years at TI, most recently as general manager of TI's custom ASIC business unit. He also served as the general manager of the communications infrastructure ASIC business unit, and general manager of the cable broadband communications business unit. Prior to TI, he worked as a circuit design manager on the Pentium design team and a senior design engineer on the 80486 design team at Intel. He has an M.B.A from the University of Phoenix and an M.S.E. E. from the Institut Superieur D'Electronique in France.

Littelfuse Silicon Protection Array (SPA™) Sample Kits Available Exclusively at Mouser

June 14, 2010

Mouser Electronics, Inc., known for its rapid introduction of the newest products, today announced it is the only distributor to be stocking Littelfuse Silicon Protection Array (SPA™) Sample Kits.
Modern chipsets utilize nanometer processing technologies making them extremely susceptible to damage which necessitates the need for external protection. Silicon Protection Arrays™ (SPA) are specifically designed to protect sensitive electronic components from ESD (Electrostatic Discharge), EFT (Electrical Fast Transients), and lightning induced transients. The Littelfuse SPA devices offer the lowest dynamic resistance during an ESD or any EOS (Electrical Over Stress) event which reduces clamping voltage levels far below that of competing technologies such as MLV, MOV, and polymer. The SPA portfolio offers a wide range of devices to suit the majority of applications available in the market today such as: USB 2.0/3.0, HDMI 1.3/1.4, DVI, 10/100/1000Mbps Ethernet, eSATA, 1394a/b, LVDS, audio, analog video, keypads/pushbuttons, and LCD/camera display interfaces.
Mouser is exclusively offering the SPA Sample Kits that include ten samples each of the 39 SPA devices. Additionally, each flexible notebook includes a product selection guide and protection samples of 16 different common applications. Ultimately, the sample kit provides a cost-effective supply of various SPA devices for the convenience of design engineers.
Andy Kerr, Mouser Vice President of Passives & Circuit Protection, says the new SPA devices will solve numerous issues presented by today’s ICs that have contact discharge levels down to ±0.5kV. Kerr says, “The Littelfuse Silicon Protection Arrays are an ideal solution for new ICs facing the threat of ESD damage. In addition, the SPA kits offered by Mouser will provide a cost-effective SPA supply and documentation for many suitable applications.”
“The Littelfuse line of Silicon Protection Arrays clearly delivers superior protection for today’s demanding electronic applications.” adds Paul Dickinson, Littelfuse Vice President & General Manager of the Semiconductor Products Business. “We are proud to partner with Mouser to offer devices that will address these challenging circuit protection issues for design engineers.”
Known for its focus on design engineers with its broad product line, unsurpassed customer service, advanced on-line catalog and innovative product marketing, Mouser continuously offers customers the newest products and latest technologies for their new design projects.
Mouser Electronics’ website with interactive online catalog is updated daily and searches over 6.7 million products to locate over a 1.6 million part numbers available for easy online purchase. Plus, it houses downloadable data sheets, supplier-specific reference designs, application notes, technical design information and engineering tools.

MSC-Gleichmann Schweiz AG starts with four offices and 18 employees

June 14, 2010

The MSC-Group, one of the leading pan-European distribution companies in the sector of electronics components and systems, has now combined its existing three Swiss regional companies MSC Schweiz AG, Gleichmann Ultratec AG and Gleichmann Electronics Schweiz AG under the new name MSC-Gleichmann Schweiz AG. This step was taken in order to underline the company’s solution competence and further optimizes its regional customer support in Switzerland.
The new company, which initially starts with 18 employees, is led by Stefan Jutzi, Markus Gabrielli and Velmir Ceko. With four locations in Rotkreuz, Montreux, Biel and Volketswil, MSC-Gleichmann Schweiz AG is represented in both the German and French speaking parts of Switzerland.

“By combing personnel resources, which till now were distributed over the three existing companies, into MSC-Gleichmann Schweiz AG, the system competence of MSC-Gleichmann in the sectors microcontrollers, programmable logic, displays, batteries, quartz and RF products will be strengthened even more than previously,” explained Velimir Ceko.

“Especially customers that are looking for complete application-specific solutions in the form of starter kits or board-level products such as MSC’s ETX or Qseven platforms can now be supported in a more targeted and far more efficient manner,” added Stefan Jutzi.

Markus Gabrielli also sees advantages for customers in the centralized logistics. “The uniform handling of all Swiss orders using our ultra-modern MSC and Gleichmann electronics central warehouse in Germany, which is equipped with automated packaging and shipping systems, not only helps our customers to minimize their own logistics costs, but also guarantees them a high level of security and delivery reliability.”

Photo caption:
Management team of the new company MSC-Gleichmann Schweiz AG (from left): Velmir Ceko, Markus Gabrielli and Stefan Jutzi.

Large-Screen TV Maker Chooses Si217x Silicon Tuner for Its Exceptional Performance and Integration

June 8, 2010

Silicon Laboratories Inc. (Nasdaq: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, today announced that Mitsubishi Digital Electronics America, Inc. has chosen the award-winning Si217x silicon TV tuner for its Unisen(TM) brand of Immersive Sound LED TVs.
Mitsubishi's Unisen models are the first TVs in production to fully realize the benefits of the industry-leading footprint and performance of Silicon Labs' Si217x silicon TV tuner by mounting the IC directly on the main system board rather than using separate tuner modules. Mounting the TV tuner directly on the main board reduces the PCB area and cost of the tuner design, while enabling development of thinner TV designs.
"Mitsubishi's Unisen Immersive Sound LED TVs incorporate state-of-the-art components for full 5.1 Dolby® Digital surround-sound, a superior picture with enhanced color, and reliable tuning and reception," said Frank DeMartin, vice president of marketing, Mitsubishi Digital Electronics America. "Silicon Labs' Si217x TV tuner meets our very high performance standards, and the straightforward implementation allows us to easily realize the benefits of a tuner-on-board design."
The Si217x IC is the industry's first silicon TV tuner to exceed the performance of traditional discrete TV tuners, enabling TV makers like Mitsubishi to deliver enhanced picture quality and better reception for both analog and digital broadcasts.
"The Si217x silicon tuner enables thinner form factors and a reduced bill of materials on the RF front end without compromising RF performance," said Dave Bresemann, vice president of Broadcast products at Silicon Labs. "By implementing the silicon tuner IC directly on the main system board of Unisen TVs, Mitsubishi has stepped forward as a pacesetter in the TV industry, providing consumers with the latest TV technology."

Available in screen sizes of 40, 46, and 55 inches, Unisen Immersive Sound LED TVs containing Silicon Labs' Si217x silicon tuner are designed in the United States and will be available to consumers this year.

Vishay Releases New TFU Thick Film Flat Chip Fuses in Compact 0603 Chip Size

June 8, 2010

Devices Provide Rated Current Values Up to 4.0 A With a Breaking Capacity of 35 A at Rated Voltages
MALVERN, Pa. — June 3, 2010 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced the release of new TFU 0603 thick film flat chip fuses that offer very quick-acting fuse characteristics in a smaller chip size. The devices feature rated current values up to 4.0 A and a breaking capacity of 35 A up to a rated voltage of 32 V.
Featuring the standard RR 1608M metric case size [1.55 mm by .85 mm by .45 mm], the Vishay Beyschlag TFU 0603 fuses are designed to provide secondary overcurrent protection for dc-to-dc converters, battery chargers, and low-voltage power supplies in mobile consumer electronics devices. A highly controlled manufacturing process, combined with Vishay's advanced thick film technology, provides an outstanding long-term stability of fusing characteristics for mobile devices such as cell phones, PDAs, digital still cameras, camcorders, and LCD flat screen displays.
The halogen-free and lead (Pb)-free TFU 0603 devices support lead (Pb)-free soldering and are suitable for processing on automatic SMD assembly systems using wave, reflow, or vapor phase processes. The new fuses feature a coating that protects against electrical, mechanical, and climatic hazards.
Terminations for the new lead (Pb)-free TFU chip fuses are pure tin on nickel plating. The immunity of the plating against tin whisker growth has been proven under extensive testing. The new devices comply with the CEFIC-EECA-EICTA list of legal restrictions on hazardous substances. The TFU Series devices are tested in accordance with the UL 248-14, IEC 60127-4, and IEC 60668 standards and are listed under the UL recognition program of Underwriter Laboratories Inc.
Samples and production quantities of the new thick film flat chip fuses are available, with a lead time of 4 to 6 weeks for larger orders. Follow Vishay's thick film flat chip fuses at

Murata's latest series of chip inductors replaces wire-wound inductors to reduce size and cost of DC-DC power supplies

June 8, 2010

Murata's latest series of chip inductor is designed to replace wound inductors in DC-DC converter applications, reducing the footprint of power supply designs by replacing larger inductors without compromising performance. The LQH6PP_43 series can also help to reduce cost, since chip inductors' simple structure means they can be constructed more cost efficiently than traditional wire-wound power inductors, leading to reduced bill of materials cost for power supplies.
Designed especially for the miniaturisation of DC-DC converters in LCD TV and set top box applications, the LQH6PP_43 series features compact low-profile 2424 size casing - measuring just 6.0 by 6.0 by 4.3mm. The parts are magnetically shielded by magnetic resin, minimising any possible magnetic interference.
The LQH6PP_43 series' low DC resistance and high rated current contribute to the efficiency of the power supply circuit. The series ranges from a 1.0µH model with DC resistance 0.009 Ohm, to a 100µH model, with DC resistance 0.436 Ohm. Allowable DC current, based on inductance change within 30% of nominal, is 7.50A (for 1.0µH part) to 0.92A (for 100µH part).

For further information and reader enquiries:
Aya Tonooka, Murata Electronics (UK) Ltd., Oak House, Ancells Road, Ancells Business Park, Fleet, Hampshire GU51 2QW , United Kingdom
Tel: +44 (0) 1252 811666
Fax: +44 (0) 1252 811777

Murata Power Solutions honours Digi-Key with Distributor award

June 8, 2010

Murata Power Solutions has awarded Digi-Key its Top Growth Distributor for 2009 award. The award was presented at the Electronics Distribution Show held in Las Vegas, Nevada, May 10th -13th 2010. Digi-Key has been an authorised distributor for Murata Power Solutions since 2008.
Commenting on Digi-Key's performance in 2009, John Barnes, Distribution Manager for Murata Power Solutions said: "Digi-Key has demonstrated a commitment to excellence since establishing our partnership and continues to show impressive growth and consistent quarter over quarter growth."

"Digi-Key takes pride in knowing our efforts to distribute the broadest range of top-quality products to customers worldwide are recognised by our leading authorised supplier partners," said Jeff Shafer, Vice President, Digi-Key. "We are honored to be named the Top Growth Distributor in 2009 and look forward to continuing our successful partnership with Murata Power Solutions."

For further information and reader enquiries:
John Sutherby, Marketing Communications Department, Murata Power Solutions
Tel: +1-508-339-3000 x 117

Rutronik: Murata reduces the size of its AMR magnetic switches

June 3, 2010

Murata has reduced the size of its AMR magnetic switches, saving space and cost in consumer electronics applications. AMR (Anisotropic Magneto Resistance) magnetic switches are primarily used for open/close detection in home appliances such as white goods and security equipment as well as other consumer electronics devices. Murata's range of AMR switches is now available in an ultra small package measuring 1.0x0.9x0.5mm, in addition to industrial standard package sizes such as SOT23 and SON4 at distributor Rutronik.

Avago Technologies releases Multi Mode 3x3 Power Amplifier modules

June 3, 2010

Avago Technologies, a leading supplier of analog interface components for communications, industrial and consumer applications, today announced ten new compact UMTS Power Amplifier Modules that maximize handset talk time and extend battery life. UMTS Bands 1, 2, 4, 5 and 8 are supported. The ACPM-500x PAMs (Power Amplifier Modules) are designed to meet the requirements of MultiMode applications including UMTS (universal mobile telecommunication system), CDMA (code division multiple access) and LTE (long term evolution).
The ACPM-520x PAMs are optimized to maximize the PAE at maximum RF powers by adjusting maximum output powers. These modules are intended to meet UMTS specifications. With multiple product lines, customers have the flexibility to choose the right products for their application.

The First Flexible Powerline-Communication Solution for Industrial Applications

June 3, 2010

MSC Vertriebs GmbH presents Cypress's newly announced Powerline Communication solution and AC-DC digital power controllers for LED lighting, as well as the Power PSoC® family of integrated embedded power controllers. The new AC-DC controllers offer a cost-effective solution for both non-dimmable and dimmable LED lighting, delivering high efficiency while meeting EnergyStar requirements. The AC-DC controllers complement the PowerPSoC family of embedded power controllers, the industry's first single-chip solution for both controlling and driving high-power LEDs. Both, the AC-DC family and the PowerPSoC family cover a wide range of LED applications, from LED retrofit bulbs to high-end LED luminaires that require a variety of functions such as communications, diagnostics, color-changing, etc.

SPI Series - SMT Power Inductors in Six Form Factors

June 3, 2010

The SPI series SMT power inductors from YDS, available at MSC Vertriebs GmbH, includes six form factors from SIP0403 (4.5 mm Ø × 3.2 mm height), 0504, 0703, 0705 and 1004 to 1054 (10 mm Ø × 5.4 mm height) that meet the requirements of virtually all applications. Available are all usual inductance values, including customer specials.
An important feature of the SPI series is that the entire component volume is used as winding space or magnetic media. Low resistive and magnetic losses guarantee high efficiency of applications build with these inductors. The top surface is consistent flat and ideal or automatic pick and place equipment.
Highest quality and low cost make the SPI series inductors the perfect choice for any system from industrial controls, medical and commercial equipment to home electronics.

SiTime Corporation and MSC Vertriebs GmbH Sign Pan-European Distribution Agreement

June 3, 2010

MSC Vertriebs GmbH and SiTime Corporation signed distribution agreement covering whole Europe and Turkey. The company's solutions are the heartbeat of high-performance electronics such as FTTH (Fibre To The Home) and Passive Optical Networking (PON) equipment, 10-Gigabit Ethernet switches, computing and storage servers as well as high volume applications such as digital cameras, LCD HDTVs, PC desktops and laptops, Set Top Boxes (STB), time switch clocks, programmable controllers, multi-function printers Solid State Drives (SSD) as well as for various applications of the automotive sector.

Rutronik presents new 40V Precision Operational Amplifiers

June 3, 2010

Rutronik presents the ISL28117 and ISL28217, the latest members of Intersil's bipolar low-power precision operational amplifier series. These new products feature an ideal combination of low noise and low power coupled with low offset voltage, low bias current drift and minimal offset drift over temperature. The products are ideal for applications that require reduced power consumption, high DC accuracy and AC performance needed to condition a wide range of precision analog signals. The single ISL28117 and dual ISL28217 are capable of reducing signal conditioning error when compared with competing solutions. This is achieved through a combination of lower noise, lower offset voltage, lower bias current and higher gain accuracy. These amplifiers enable high gain processing of wide common-mode voltage signals with much better accuracy than competing solutions.

Mouser Stocking Texas Instruments TPS63020 Power Management IC

June 3, 2010

Mouser Electronics, Inc. announced it is stocking the Texas Instruments TPS63020 Power Management IC. The Texas Instruments TPS 63020 power management IC is the industry's smallest and highest performance buck-boost converter with a 4-A switch and up to 96 percent efficiency. The TI TPS63020 power management IC helps extend battery life in smartphones, portable medical equipment, DLP® pico projectors, and other battery powered multimedia devices. The TI TPS63020 buck-boost converter operates with a wide input voltage range of 1.8V to 5.5V and can discharge lithium batteries down to 2.5V or lower while maintaining excellent light load efficiency. Also available from Mouser is the TI TPS63020 EVM-487 evaluation module which is a fully assembled and tested circuit for evaluating the TPS63020 buck-boost converter with 4A switch.

5.7-Inch VGA TFT Display: TX14D10VM1BAA

June 3, 2010

MSC Vertriebs GmbH closed a gap in the world's display market with Hitachi's brand new TFT, which provides an LVDS interface. It allows easy handling with a large number of standard controller boards, which relies on the established LVDS interface. The connector used for data transfer and the pin out, well known from several display sizes, enables an easy and convenient adaptation to other applications. The optical behaviour of the TX14D10VM1BAA is the very same as the available TX14D17VM1BAB display module that supports a customary TTL/CMOS interface. Now the advantages of each display can be considered for selecting the adequate interface for the application.
The TFT is optimized for a viewing direction of 6 o'clock. Because of the implemented latest LED technology, the power consumption had been decreased significantly below 1.5 W. Hitachi specified the brightness with typical 350 cd/m² and a contrast of 350:1.
The high-grade panel corresponds to the industrial standard and features a wide temperature range from -20 up to +70 Celsius degrees.

DSM Public Display systems with Full HD

June 3, 2010

DSM Computer's high-quality DSM Public Display systems specially developed for sophisticated digital signage applications now provide Full HD capability. The DSM Public Display systems consist of a high-performance DSM embedded PC module for the complete display control and a large-format NEC® TFT monitor. The PC module with a width of only 41 mm can be inserted as an integrated solution without complex cabling and without additional power supply in the slot provided on the monitor. Should the display system need to be upgraded or in the case of a service call, the embedded module can be simply replaced directly on-site. The modular computer plug-in unit can be used independent of the screen size; various TFT monitor types with a screen diagonal size of 102 cm or 117 cm are currently supported. On request, Public Display systems with 165 cm monitors can also be supplied. For optimization on the various applications, the compact DSM embedded PC module is available with scalable computer power. The Intel® Core™ 2 Duo Mobile processor variants with 667/533 MHz front-side bus, Intel® Core™ Duo/Solo Mobile, and alternatively Intel® Celeron® M 440/530, can be selected.

Farnell sponsors 3 athletes with a disability, each with ambitions of competing in the 2012 Paralympic Games

June 3, 2010

element14 will follow these three elite athletes over the next two years while highlighting the latest in sports technology via a dedicated portal.
Farnell, the leading multi-channel, high service electronics distributor, is excited to announce that it is now supporting three athletes with disabilities, David Stone (Europe), Nurulasyiqah Mohammad Taha (Asia Pacific) and Sam Kavanagh (Americas), as they aspire to compete at the London 2012 Paralympic Games. Each of these athletes compete at the highest level in their sport and have all achieved significant international successes. In line with Farnell's commitment to support local communities, the Company will provide funding and support to help meet the needs of these athletes' as they continue to excel in a global competition.
In addition to the athlete sponsorships, Farnell will promote some of the latest innovations in sports technology via an exclusive Sport Technology portal on element14, the online technology e-community for electronic design engineers. This specially developed portal contains a wide range of information about technology applications used in high performance sporting events. The content will be enriched with insightful and interesting inputs from the athletes themselves via their individual blogs, as well as information from industry experts. To learn more about these technologies and the three athletes visit the Sports Technology portal at:
The European Paralympian is British cyclist David Stone who has cerebral palsy. 28-year old David, who has been cycling since the age of 8, specialises in time trial events and has achieved a string of successes in senior events around the world in recent years. He made his Paralympic Games debut in Sydney 2000 and went on to win gold medals in both road disciplines for his class at the Beijing 2008 games. David's ultimate goal is to repeat his Paralympic success on home soil, but ahead of that time he will be keenly focused on both the World Cup and World Championships.
Singaporean Nurulasyiqah Mohammad Taha has been playing boccia for the last seven years - an exciting and skilful indoor ball game designed for individuals diagnosed with cerebral palsy, muscular dystrophy or other neurological-based forms of severe physical disabilities. Boccia has now developed into a major international and Paralympic sport and Nurul has participated in several regional and international competitions - putting Singapore on the map for the sport. With support from Farnell, Nurul hopes to realise her aspiration to do well in the upcoming London 2012 Paralympic Games and beyond.
The North American athlete is Sam Kavanagh, a US track sprint cyclist whose interest in the discipline began after he had to have a part of his left leg amputated following an avalanche accident in 2005. Sam has his sights set on success in London in 2012. Sam is also a Civil Engineer, and has a desire that his actions encourage and inspire others to overcome obstacle in their life so they may achieve all they are capable of, with no regrets. Sam has chosen to live his life as an amputee, not on the sidelines, but rather striving to push his abilities to new levels in hopes of advancing prosthetic technology and changing society's perception of those with physical disabilities.
“Sam, David and Nurul are remarkable individuals who embody the high performance traits that we at Farnell truly value,” said Harriet Green, CEO of Farnell. “They are an inspiration to all and throughout the next two years we will celebrate their progress, support them in their goals and work with them to understand the role that technology plays in their sporting achievements.”

Mouser honored with Emerson Network Power Connectivity Solution's 2009 Top Distributor Award ... Again

June 3, 2010

Mouser Electronics, Inc. announced it has been awarded Emerson Network Power Connectivity Solution's 2009 Top Distributor Award. Emerson is a global leader in embedded telecommunications and data network infrastructures. Two of Emerson's major connector brands, Johnson and Aim-Cambridge, provide the product lines to Mouser and consist of RF audio/video connectors, cable assemblies, and adapters. Known for its focus on design engineers with its broad product line, unsurpassed customer service, advanced on-line catalog and innovative product marketing, Mouser continuously offers customers the newest products and latest technologies for their new design projects. Mouser Electronics' website with interactive online catalog is updated daily and searches over 5 million products to locate over a million part numbers available for easy online purchase. Plus, it houses downloadable data sheets, supplier-specific reference designs, application notes, technical design information and engineering tools.

Rutronik to Distribute Maxwell's Ultracapacitors throughout Europe

June 3, 2010

Maxwell Technologies and Rutronik Elektronische Bauelemente GmbH announced an agreement through which Rutronik will distribute Maxwell's BOOSTCAP® ultracapacitor products throughout Europe. Under this new contract, Rutronik will especially address the European industrial, automotive, renewable energies and other key energy storage market segments with Maxwell's ultracapacitor products. vailable in a range of sizes and modular configurations, BOOSTCAP® ultracapacitors from Maxwell bring high levels of efficiency (>95%) and power (10kW to MW) to a wide range of applications, including consumer electronics, hybrid cars and renewable energy sources.

Mouser Receives Award from Exar for Outstanding Contributions in New Product Promotions

June 3, 2010

Mouser Electronics, Inc. announced it was recognized for its outstanding contribution in the promotion of Exar Corporation products. Exar is the industry leader in UARTs and their innovative programmable PowerXR power management ICs are used in a wide variety of applications where multiple supply voltages are required. At the April 2010 Exar Sales Conference in Las Vegas, Mouser Electronics was presented with an award in recognition of outstanding contribution in the promotion of Exar Products. Reasons cited for the prestigious award was Mouser's success in vastly increasing sales month over month for the last 16 months. Mouser was also responsible for introducing thousands of new customers to Exar's extensive array of power management, communications, and interface silicon solutions through internet and catalog marketing.

Premier Farnell leverages the power of social media and web 2.0 to update global customers during air disruption

June 3, 2010

Farnell, the leading multi-channel distributor, has announced that its unique biodegradable packaging has won Environmental Product/Service of the Year at the UK's Sustainability Live Environment and Energy Awards, fighting off competition from more than 60 entries. The judging panel was highly impressed with the exciting new packaging solution, a first for the electronics industry, which was implemented by Farnell in September 2009, to replace polythene packaging for an estimated 3.6 million orders despatched from the company's European warehouses each year.
The unique packaging, which is capable of breaking down in an industrial composter, or dissolving simply in hot water, uses patented technology, exclusive to Farnell, to fully biodegrade without releasing any harmful chemicals into the environment, while offering the same level of component protection as standard static dissipative bags.
Polyvinyl Alcohol (PVOH) - widely recognised for its soluble characteristics that have been used to prevent the spread of infection in Healthcare and Agriculture - was identified for its anti-static properties and the environmental benefits it presented for the Farnell business and the wider electronics industry. Recognising its suitability, the company patented and developed the product further in collaboration with packaging specialist Antistat.
Commenting on the win, Paul Horton, Director of Supply Chain Farnell Europe, said: “We are absolutely delighted with the recognition provided to Farnell with this industry leading award. Farnell is committed to social responsibility, recycling over 80% of our own waste in the UK, we are now working to extend that commitment and assist our customers in reducing the waste that they send to landfill.”
John Hensley, Managing Director of Antistat said: “Farnell's innovation in the environmental space is a great example of a leading business's commitment towards being responsible. We are proud to have been associated with Farnell throughout the development stage and share the delight in receiving the Product of the Year award.”
With plans already in place to roll out the new packaging to its warehouses in Asia and the US, Farnell have also offered the packaging available for sale to electronic design engineer customers via its 40 global websites and are leveraging relationships with leading component manufacturers for them to use this environmentally-friendly alternative. Several global manufacturers have already expressed interest and are currently looking into specifications to meet their own business requirements.
In addition, the product is now undergoing further development by the company to understand how the material can be used to support our industry in the future and reduce the impact that the electronics industry has on the environment.

Mouser Honored with Neutrik's “Distributor Partner of the Year”

June 3, 2010

Mouser Electronics, Inc., known for its rapid introduction of the newest products, today announced it was awarded Neutrik's 2009 “Distributor Partner of the Year”.
The prestigious award was presented to Mouser at the annual EDS convention in Las Vegas this month. Reasons cited for selecting Mouser above other distributors was Mouser's commitment to provide an exceptional customer service experience by rapidly offering the latest products and newest technologies as soon as they are available. Also mentioned was Mouser's commitment to innovation, such as the interactive online catalog and technical support. Known for its focus on design engineers with its broad product line, unsurpassed customer service, advanced on-line catalog and innovative product marketing, Mouser continuously offers customers the newest products and latest technologies for their new design projects.

Farnell presented with Outstanding Electronic Distributor award by Hammond Manufacturing

June 3, 2010

Farnell, the leading multi-channel distributor, has received the Outstanding Electronic Distributor 2009 award from leading electronics enclosures supplier Hammond Manufacturing. The award has been presented to Farnell in recognition of its ability to successfully bring the latest Hammond products to market and for excellent sales performance during 2009.
Farnell offers a comprehensive choice of over 600 of Hammond Manufacturing's industry-leading range of enclosures for electronics equipment. The two companies have worked together for 12 years. Through its in-house technical capabilities and by sharing a close working relationship with Hammond Manufacturing, Farnell has been able to help its customers to quickly and efficiently select the most appropriate enclosure systems for their new applications. The company's own technology portal and eCommunity - element14 - created exclusively for electronic design engineers is already helping design engineers gather relevant information and discuss their applications with others in the industry.

Premier Farnell leverages the power of social media and web 2.0 to update global customers during air disruption

June 3, 2010

As a leader in high service distribution with a passion for customer communication Premier Farnell has embraced the power of social media and web 2.0 to share up-to-date information with customers. Throughout this period of disruption to air travel the company has demonstrated this commitment to open and ongoing communication, and has been able to keep customers appraised of the detailed business situation in a timely manner via its local language websites, Facebook and Twitter.
Through the power of the element14 community engineers have also continued to connect with each other and work on their designs unaffected by the situation. As a high service distributor Farnell is leveraging its extensive worldwide stockholding and working very closely with its global freight partners to ensure customers receive on-time deliveries and to minimise any disruption, with next day delivery being achieved in most countries. The company has invested in key warehouse locations around the world enabling it to continue to provide the same high levels of service at a time when other businesses with more centralised warehouses are struggling.
“As the situation is beyond our control we have focussed our energy on communication and continuing to meet customer need to ensure the crisis does not interfere with our commitment to on-time delivery. Such situations reiterate the importance of being able to share detailed information with customers at speed and our strong web presence has ensured this has been possible. We have successfully communicated frequent local updates in all regions, and are working round-the-clock to keep our customers informed via our websites, twitter and facebook news pages, demonstrating once again the power of these tools to business today”, said Neil Harrison, President for Farnell Europe. “We are well equipped to continue business as normal in times of adversity and welcome the news that the disruption is showing signs of improvement. We will continue to communicate frequently until the situation returns completely to normal.”
Anyone looking for information can access via and select their country of operation for up to the minute information.

element14 celebrates Earth Day by sponsoring The Power of One Solar Car as design engineers work to minimise climate change

June 3, 2010

element14, the new online technology resource and collaborative community for electronic design engineers, in recognition of Earth Day, announces its sponsorship of The Power of One Solar Car Project.
element14 recognises that design engineers are the key in helping to create future technology that will prevent further damage to the Earth’s precious resources, and The Power of One Solar Car is a prime example of how this technology can help. element14 is a natural sponsor for this project, creating awareness of the important role of design engineers’ innovative designs to combat climate change and protect our environment by harnessing the Earth’s natural energy.
The Power of One (xof1 for short) project was officially created in 1999 by Marcelo da Luz as a project for individuals from various backgrounds to come together to promote the use of clean and sustainable energy while inspiring others to do the same. The Power of One team has created a dedicated blog on element14 to share their latest developments with engineers and enthusiasts at
element14 provides a community environment where electronic design engineers can find unbiased technical information and tool-focused services to enhance their design and development capabilities. With dedicated portals on alternative energy, power management and legislation, element14 provides design engineers with a wide variety of information to facilitate early stage design and an environment where users can reach out to peers and industry experts to start discussions and pose questions. A true value added benefit of element14 is the ability for engineers to collaborate on design techniques or seek new technology developments from experts in the field.
“element14 gives electronic design engineers from around the world the chance to participate and share their specialist knowledge and enthusiasm on environmental design”, said Alisha Mowbray, Senior Vice-President, Marketing for element14. “element14 was specifically created for design engineers and students looking for the opportunity to share technical information and have access to the latest design engineering resources as well as important info about environmental legislation. There is no better way to bring a group of design engineers and students together than through innovation and good design practices as seen with The Power of One Solar Car Project.”
element14 is proud to promote green designs and in the coming weeks will be featuring the new product developed as part of Premier Farnell's Live EDGE competition. The design by John Noble was the winning design of the first Live EDGE competition in 2008 and he has been working diligently to bring his environmentally friendly designs to the market.

SMT Info

New high-profile distributor extends support for DEK customers in Southern Germany

June 14, 2010

DEK has appointed SmartRep to distribute its high accuracy mass imaging technologies in Germany, extending product accessibility and support opportunities for customers in South Germany.
Providing valuable extra resource for DEK customers in Germany, SmartRep will now apply its in-depth knowledge of electronics manufacturing technologies to help customers expect more from their print processes with DEK technologies. Spanning powerful print platforms, Productivity Tools, Performance Improvement Products, precision screens and high performance stencils, the DEK range is extremely popular in Germany where manufacturers welcome the competitive advantage it represents. DEK Sales Manager for South Germany, Patrick Thiel, will manage corporate accounts in the region, working with the SmartRep team to deliver the advanced level of service and support to which DEK customers worldwide are accustomed.
Commenting on the SmartRep appointment, DEK General Manager for Western & Central Europe, Stefan Techau, explains: “The addition of SmartRep to our well established German DEK Team is great news for us and our customers in this region. The move represents our continual investment into the German marketplace, ensuring we safeguard our market leadership and satisfy the evolving demand of this customer base with unparalleled reach and responsiveness. As a technology leader, we’re constantly looking for new ways to help our customers expect more. A key part of this is obviously the technologies we deliver. However, technology is nothing without sales support and process consultancy to back it up – which is why we’re committed to partnering with specialists who understand the precise needs of our customers. I’m confident that SmartRep will deliver the outstanding level of sales support our customers need to Expect More – I’m delighted to welcome them to the DEK team!”

Test Protocols for Evaluation of New Lead-Free Alloys Outlined in New White Paper by IPC Solder Products Value Council

June 9, 2010

The IPC Solder Products Value Council (SPVC) has published a free white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that provides a set of test protocols for the evaluation of new lead-free alloys on the basis of their physical properties. Developed in cooperation with leading original equipment manufacturers (OEMs) and electronics manufacturing services (EMS) companies, the white paper will help the electronics assembly industry reduce the time and effort required to characterize an alloy and improve its processes without jeopardizing reliability.
The advent of regulations in Asia and Europe restricting the use of certain substances has forced solder material suppliers to provide the electronics industry with solders that are lead free and, at the same time, provide all the needed properties, including reliability and ease of assembly. Since then, solder suppliers have focused their efforts on improving their products and offering an ever-growing choice of alloys. Unfortunately, the lack of physical data available for these new alloys as well as inconsistent test methodology makes it virtually impossible to compare alloy properties and introduces uncertainty as to which to use.
The SPVC white paper prescribes general requirements for determining critical physical and mechanical properties of bulk lead-free solder alloys used to make high quality electronic interconnections. The document describes material tests that generate portable data for: (1) direct comparison of different alloys; (2) aiding in alloy acceptability determination for various applications; (3) development of reliability models; and (4) other uses.

For more information on Analytical Procedures for Portable Lead-Free Alloy Test Data or to download the free white paper, visit For more information on the activities of the IPC SPVC, contact Tony Hilvers, IPC vice president of industry programs, at


June 9, 2010

In response to member requests for benchmarking data, IPC — Association Connecting Electronics Industries® released IPC Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2009. This report is designed to provide information to EMS companies interested in comparing their key 2009 operating variables to those of other EMS providers by net sales and type of product.
The survey-based study covers financial and production data, assembly attributes, yields, defect rates (DPMO), customer returns, supplier performance, customer satisfaction and certification data. Surveys were e-mailed in March 2010 to IPC member companies identified as providers of EMS or contract assembly services. The survey sample includes twenty-four EMS companies, primarily small and medium-sized, with 2009 net sales ranging from under $1 million to more than $100 million.
Participants provided point-of-reference data for sales growth, expenses on research and development (R&D) and capital equipment as a percentage of net sales, average collection and payable periods, and the number of printed circuit boards (PCBs) completed in 2009. Respondents also reported internal yields for key processes, including surface mounting, wave soldering and selective soldering. All of the respondents included relevant customer satisfaction metrics regarding returns and on-time customer deliveries.
IPC Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2009 is available for sale to IPC members for $475 and to nonmembers for $950. The report is free to companies that participated in the survey. For more information or to purchase the report, visit or contact Sree Bhagwat, IPC market research manager, at or +1 330-677-5563.
For information on IPC market research programs, contact Sharon Starr, IPC director of market research, at or +1 847-597-2817, or visit

Restyled OK International website offers rich supply of new resources

June 9, 2010

Global electronic assembly products and industrial supplier OK International ( has announced the launch of their restyled website that highlights an array of new resources and services.
Visitors previously familiar to the site will immediately recognize a new homepage with 5 new navigation icons providing quick access to the site’s most important and informative zones. These include a new Solar Zone dedicated to photovoltaic module manufacturing technologies. The recently released PS-900-Solar employs SmartHeat® technology proven to minimize thermal stress and prevent micro-cracking during tabbing and bussing operations.
Customers can now register one-time in the new Customer Zone and have access to
an extensive array of technical documentation including data-sheets, application notes, research papers and process studies. They can then return anytime, login, and access new information.
Visitors can still find part numbers, specifications, manuals and updates for the entire product range that includes bench top soldering and desoldering tools, array package rework equipment, fluid dispensing systems and accessories, and fume extraction systems.
Direct links to the OK International Web Stores in both North America and Europe can be readily accessed, as can the video zone which offers informative and educational process and product videos.

Sensor manufacturer VEGA implements SIPLACE Facts

June 3, 2010

VEGA Grieshaber KG (VEGA) in Schiltach, Germany, a manufacturer of modern level measurement sensors, level switches and pressure transmitters, successfully implemented SIPLACE Facts in the first quarter of 2010 to install a transparent inventory management system in its SMT production. With its new system, VEGA is able to enter incoming component deliveries at the packaging unit level, localize them and record their consumption. This level of seamless inventory control provides significant benefits for VEGA, because it speeds up material removals and returns from and to storage considerably while shortening the materials' travel distances. The packaging unit-based inventory overview including setup control prevents delays caused by missing components and implements the FIFO principle throughout the entire chain. It also reduces spoilage by controlling the exposure times for moisture-sensitive devices in the warehouse. In addition, SIPLACE Facts ensures the traceability of the components VEGA processes on its two SMT lines. Thanks to SIPLACE Facts, expensive physical inventories are now a thing of the past for the sensor manufacturer. With the help of SIPLACE experts, VEGA started to replace its old electronics manufacturing software in December of 2009.

The Spanish company Televés S.A. invests in innovative SIPLACE line

June 3, 2010

From Left to right: Ricardo Aleixo (SIPLACE Support Portugal/Spain), Roberto Zapico Cerqueiro (Televés/Spain), Julio Viqueira (Televés/Spain), Eric Simonin (SIPLACE System Acceptance Germany)The Spanish company Televés S.A., a market leader in Radio and TV installation solutions, has been at the forefront of innovations since its foundation in 1958. One of Televés' main success factors is the 25 years of close cooperation with Siemens Electronics Assembly Systems (SEAS). In order to be prepared for further innovations and growing product demands, Televés invested once again in a new SMT production line consisting of the latest SIPLACE SX2 and SIPLACE CA (Chip Assembly) machines. With the new SIPLACE line Televes acquired the potential to cover all future requirements with optimum flexibility combined with bare-die and classic component processing. “The key elements of our success are innovative products and production processes. With the new line we continue to secure our sustainability,” confirms Jorge Montero, Manufacturing Manager at Televés. “The SIPLACE machines offer us the innovative potential and maximum flexibility needed in order to be successful for many years to come.”
SMT/HYBRID/PACKAGING trade show (Hall 7, Booth 204).

New software for ASSEMBLÉON's A-SERIES cuts New Product Introduction (NPI) time by 30%

June 3, 2010

Royal Philips Electronics subsidiary Assembléon is cutting NPI time on its A-Series pick & place equipment by 30%. The improvement is the first result of Assembléon's strategic partnership with Valor - a division of Mentor Graphics - which brings a full suite of NPI and MES factory integration tools to automate machine-, line- and factory-level workflows and business processes. The result is a lean manufacturing operations management framework that is open, modular, and flexible. And connects flawlessly to Assembléon's enriched interfaces enabling performance monitoring, traceability and warehousing solutions. That all helps integrate its customers' manufacturing processes. The new NPI software ranges from Valor vPlan-Lite to full vPlan. The vPlan-Lite software uniquely aims at improving New Product Introductions for A-Series equipment and is only available through Assembléon. It quickly generates run-ready optimized programs and setup instructions for Assembléon's AX-501, AX-301 and AX-201 machines, including full parts data management. A Virtual Sticky Tape option eliminates trial and error runs to bring immediate right-first-time production. The full vPlan package optimizes batch scheduling by multi-grouping, which reduces product changeover time.

DEK Solar's PV3000 metallization solution honoured by EM Asia Awards

June 3, 2010

The fifth EM Asia Innovation Awards recently honoured DEK Solar for the technology breakthrough represented by its PV3000 photovoltaic metallization solution. Celebrating the highest standards in manufacturing technologies, the prestigious industry accolade recognises the significant role played by DEK Solar in the field of solar cell production.
Presented to the DEK team at a ceremony in Shanghai, the industry accolade saw the PV3000 top the hotly-contested Alternative Energy Production Equipment category. Judged by an independent panel of industry experts in relation to innovation, challenging objectives and outstanding achievements, the PV3000 impressed high profile representatives from business, trade associations and academia with its capacity to deliver advanced levels of throughput. A breakthrough photovoltaic metallization solution, the PV3000 optimises solar cell manufacturing productivity by deploying multiple print heads in parallel. If one head halts for operator attention, the others will continue to print - virtually eliminating downtime.
Driven by six-sigma repeatability for capability in advance of current solar cell requirements, the PV3000's inherent accuracy is ideal for demanding technologies and processes such as Print-on-Print (PoP).

Marantz to highlight latest technology breakthroughs at SMT Germany 2010, Stand 7-517

June 3, 2010

The team at Marantz Business Electronics is looking forward to showcasing a wide range of innovative technologies at this year's SMT Germany, being held in Nuremberg from 8th - 10th June 2010. From stand 7-517, Marantz will provide visitors with an opportunity to see a live demonstration of its recently introduced Solder Print Inspection (SPI) technology, while also learning more about its iSpector desktop AOI system and advanced Inspection Island. Visitors to stand 7-517 will be able to see the Marantz team demonstrate its PowerSpector S1 system, employing its breakthrough “5D” technology. Where traditional 3D SPI systems measure only Height and Volume information, Marantz' 5D technology adds in true area, shape, offset measurement for the first time. Simultanuously combining 3D and 2D measurements leads to unprecedented defect detection and process control far beyond 3D only technologies. PowerSpector S1's high speed post-print solder paste inspection process incorporates patented new sensor technology. Marantz' SPI system looks set to be a major highlight on stand 7-517. SMT Germany attendees will also be able to discover Marantz' new generation iSpector desktop AOI system equipped with 1 top and 8 side cameras in 45/45-degree configuration for the first time in a desktop machine.

DEK takes productivity-boosting solutions to SMT/Hybrid/Packaging 2010 in Nuremberg

June 3, 2010

DEK is preparing to take a whole host of innovative technologies to this year's SMT/Hybrid/Packaging exhibition, being held in Nuremberg from 8th - 10th June 2010. Stand 7-305 will showcase DEK's productivity-boosting solutions, from powerful print platforms through to next-generation stencil technologies and Process Improvement Products. Taking centre stage on DEK Stand 7-305 are the Horizon 01iX and Horizon 03iX print platforms, complete with enhanced quick-access cover packages designed to improve usability and operator management. Fast changeover and 6-Sigma performance are the cornerstones of all of the Horizon iX models, with scalability and easy in-field upgradeability as differentiable advantages of the platform. Customers can determine the Horizon model that best suits their manufacturing requirements today, with the option to add advanced features such as ultra-fast understencil cleaning, automatic board support or dispense capability if and when manufacturing needs change. Visitors can also catch the Horizon 01iX on the Fraunhofer Institute's live production line running in Hall 6, Stand 430. Demonstrating state-of-the-art production techniques, the platform will utilise advanced technologies including VectorGuard® stencils, Over Top Snuggers substrate clamping, HD Grid-Lok® high density automatic tooling, Cyclone understencil cleaning, HawkEye® print verification and next generation Instinctiv™ V9 user interface.

DEK Partners with Fuji Do Brasil to Advance Brazilian Market Stronghold

June 3, 2010

While DEK is arguably the leading print platform among Brazilian electronics manufacturers, the company sees even more growth potential in this key region and, therefore, has partnered with manufacturer's representatives Fuji Do Brasil to expand the DEK presence.
With a well-trained expert staff of over 50, offices strategically located in the cities of Campinas, Sao Paulo, Curitiba and Manaus, and a complete training and demo facility, the Fuji team offers the support and knowledge base consistent with DEK's world-class reputation. The staff has decades of electronics manufacturing experience, providing customers with broad technical and process know-how. Top EMS and OEM firms have selected Brazil as their South American hub, which is a testament to the confidence in the region and its immense growth potential. As the leading manufacturer's representative in Brazil for over 15 years, Fuji Do Brasil is well positioned to capitalize on the dynamics of this region and further expand DEK's market share lead.

Sensors / Connectors

New CFast Host Connector from ITT enables faster storage speeds for Compact Flash standard devices

June 3, 2010

ITT Interconnect Solutions has announced a new 24-pin surface mount CFast host connector which meets Compact Flash standards introduced by the Compact Flash Association (CFA). A founding member of the CFA since 1995, ITT ICS helped develop the CF standards, which required designers to integrate both parallel and serial interfaces into a single connector and cover set package. The new CFast specifications are based on SATA (Serial Advanced Technology Attachment) and require connector solutions which combine Compact Flash (CF) and ATA Serial Transport (AST) to provide flexibility and speed in a wide variety of applications, from enterprise storage systems to hand-held portable devices. The new ITT CFast 24-pin surface-mount host connector was developed to meet the demand for faster storage speeds needed by devices such as high-end video and digital cameras, personal computers and security and medical equipment.

The new Industrial Mini I/O connector system from Tyco Electronics

June 3, 2010

The new Industrial Mini I/O connector system from Tyco Electronics features two points of contact to maintain performance and increase reliability in high vibration environments. The compact connector, approximately one-fourth the size of a traditional RJ-45 plug, includes a latching system designed to protect the plug from pull-out during high vibration or collision. The product - suitable for industrial controllers, PLC's, motion control and robotics in the industrial automation market - meets Cat5e requirements when used in Ethernet applications.

Tyco Electronics introduces the new SlimSeal Solid State Lighting (SSL) connector for lighting applications

June 3, 2010

Tyco Electronics introduces the new SlimSeal Solid State Lighting (SSL) connector for indoor and outdoor lighting applications. The connector has been developed to meet customers' needs for a sealed, low-profile, single-row LED connector for use in a variety of rugged lighting conditions.
The SlimSeal SSL connector maintains an IP67 seal rating -- making it suitable for indoor and outdoor residential, commercial and architectural applications that are exposed to wet environments such as billboards, live event shows, street and tunnel lighting. Additionally, the connector can be used in traditional lighting fixtures and commercial refrigeration. Key features include UV-resistant wire-to-wire and wire-to-board configurations, SMT and thru-hole headers, positive integral latching and pre-assembled seals. The polarized, RoHS-compliant connector -- available in two, three and four positions -- accepts 18 through 24 AWG stranded wire.

Rutronik: Power up with Radsok® modules from Amphenol

June 3, 2010

Amphenol integrated the Radsok® technology in the C146 series. The new 2 pole modules for the C146 modular system are now available at distributor Rutronik. They can transmit current up to 150A at 1000V per contacts. With the crimp termination Radsok® contacts, these modules offer secure termination also in vibration environments. The male modules and contacts are designed in a way that also the pins can be touch proof, so that they can be also used when power is on the pin side of the connector.

New Perfect Wireless Interconnect announced by ITT

June 3, 2010

A new Perfect Wireless Interconnect for hand-held devices which boasts improved signal transmission and reception and no field failures has been launched by ITT Interconnect Solutions.
An additional challenge on such wireless applications is to provide a high specification interconnect to fit into extremely limited board space - in the case of an antenna interconnect, the available space measured only 0.3mm by 1.0mm and had a working height of 0.90mm.
To meet these constraints and provide an optimum solution for manufacturers, ITT ICS designers created the new Perfect Wireless Interconnect - a 300k psi domed interconnect contact with a minimum of 0.5N of force and 0.60mm of deflection which holds true signal integrity through the antenna. The Perfect Wireless Interconnect has a reduced length to fit tight spacing, yet withstands manufacturing stresses and remains stable on the board.

ITT Interconnect Solutions to exhibit new CIR M12 connector at EXPO Ferroviaria 2010 in Turin, Italy

June 3, 2010

ITT Interconnect Solutions, will be showcasing its latest connector specifically developed for the rail industry on Stand no. 708 at Ferroviaria in Turin, Italy, from June 8 - 10, 2010. Italy's only rail exhibition focuses on rolling stock, infrastructure and communications and is expected to attract a large number of international purchasers and industry experts. ITT ICS's new VEAM CIR-M12 Databus connector has been specifically designed to enable different data types to be transmitted between railway carriages via a single connector. The innovative design was achieved by integrating four conductor wires and the associated braid from shielded cables into new Quadrax QXM12 contacts, mounting them into FRCIR circular bayonet connector hardware and utilising a special plastic insert to group the multiple contacts and their cables together. The CIR-M12 Databus connector can withstand operating temperatures of -40 to +125°C.

C&K's Ultra-Miniature Halogen-Free Tactile Switch available from TTI

June 3, 2010

TTI, Inc. has announced that C&K Components has enhanced its KMT Series tactile switches using halogen-free materials. Measuring just 2.6 × 3.0 × 0.65mm, with a 0.45mm body height, the ultra-miniature, ultra high-reliability tactile switch now conforms to all environmental requirements. Halogen-free plastics are fully recyclable, so the new switches enable customers to meet their commitments to the environment. KMT series switches are also one of industry's smallest top-actuated tactile devices, suiting them to use in a multitude of space-constrained applications including mobile phones, medical products, MP3 accessories and Bluetooth headsets. Featuring an integrated push plate and a ground pin option for ESD protection, the SPST NO switches are available with gold and silver plating options and are specified for 150,000 electrical and mechanical life cycles.

Murata scoops Platinum Supplier award from TTI

June 3, 2010

Thilo Pelosato, Product & Supplier Marketing Director Europe, Discretes & Passives, TTI; Geoff Breed, Vice President Marketing - Europe, TTI; Gary Atkins, Managing Director, Murata Netherlands; Glenn Palmer, Managing Director, Murata Electronics UK; Glyn Dennehy, Senior Vice President and General Manager Europe, TTI; Terry Churcher, President of Murata EMEA.Murata has been awarded the Platinum level in TTI's Supplier Excellence awards for the second consecutive year. The award recognises outstanding performance in a number of tightly-measured categories throughout 2009.

Embedded Systems

MSC presents modular Digital Signage Solutions

June 29, 2010

MSC Vertriebs GmbH presents at KIOSK EUROPE EXPO 2010 in Essen complete POI/POS and digital signage solutions as a combination of a flexible integration platform and different full HD displays.
The 148 x 102mm small embedded platform MSC Q7-MB-EP2 integrates a compact power-saving MSC Qseven™ module and supports 1080p streams. The 1.1 GHz Intel® Atom™ processor Z510 on the computer-on-module is used to a capacity of only 18 - 20 percent. Due to the low power dissipation of the processor of less than 10W, the platform is suitable for fanless display controlling under the operating systems Linux, Windows® XP or Windows® 7.
For the digital transmission of video data without signal conversion loss, the integration platform MSC Q7-MB-EP2 offers a DVI interface. Today, DVI is the standard interface for large-scale signage displays with high resolution. More powerful HD applications can be realised via a digital high definition multimedia interface (HDMI) whereas the HDMI license is with the OEM customer.
MSC offers integration platform for customers who want to realise their own digital signage solution as well as complete full HD display systems including application-specific content management software. MSC presents an 139 cm (55 inch) display with multi touch function from Chilin, an 144,8 cm (57 inch) standard monitor and an 119,4 cm (47 inch) display with 3D functionality (without 3D glasses). An ideal complement to the current display product portfolio of the MSC-Gleichmann Group are the special format stretched TFT panels from Tovis, e.g. an 96 cm (37,9 inch) display with LED backlight and a brightness of 1000cd/m². Furthermore MSC shows professional panels from LG Display with a new liquid to move the clearing point from 80°C to 110°C for outdoor applications.
Wolfgang Eisenbarth, Director of Marketing Embedded Computer Technology, MSC Vertriebs GmbH, said: „We concentrate our company know-how to get excellent solutions for vertical markets like POI/POS and digital signage. We expect a significant growth in revenue and have completed our product portfolio of innovative modular systems for digital signage applications.“

Vector Fabrics cloud tools to automate sequential C code analysis for multi-threading

June 29, 2010

Vector Fabrics announces vfAnalyst, a cloud-based tool for parallelizing sequential C code. The first in a planned family of cloud computing tools, vfAnalyst enables software engineers to easily identify the most promising parallelization opportunities so that they can create an effective multicore implementation much more quickly than is possible today. vfAnalyst is hosted on the Amazon Elastic Compute Cloud (EC2) - a well-proven, secure server facility accessed through a standard web browser. The tool is paid for on a pay-as-you-go basis - a business model that minimizes up-front costs and eliminates software and hardware maintenance issues for customers.
Developing a multi-threaded program from sequential code is a time-consuming and expensive process to manage manually, particularly when multi-threading has not been explicitly planned ahead of time. vfAnalyst’s unique graphic interface makes it easy to identify which portions of the program can be run in parallel and what kinds of data communications are needed in order to ensure that the multi-threaded code will operate identically to – but faster than – the sequential code. In addition, vfAnalyst is intended to help engineers who are tasked with parallelizing legacy sequential code: engineers can do the project without having to know in detail how the code works.
Mike Beunder, CEO of Vector Fabrics, said, “This is the only tool of its kind. It’s not simply a matter of code profiling; it’s like a satellite navigator for parallelization, showing users things about their program that they may not even know. For example, where a series of data elements are written in one part of the program and read in the same order in another part, this is identified as data communications that could be implemented through a streaming channel. This kind of information is typically not obvious by inspection, and isn’t obtainable any other way. As a result, we can dramatically reduce time-to-market and improve code quality for our customers.”
Through its easy-to-use browser-based interface, the exploration of parallelization options can be simplified to three steps: identifying those portions of the code that would benefit from parallelism; of those, having vfAnalyst show the best candidates for partitioning; and of those, picking the ones that have the lowest cost. The analysis is done irrespective of target platform, allowing analysis of code destined for servers or embedded systems.
vfSoftware, which will be launched later this year, will be the second product in the tool family. vfSoftware starts with the kind of analysis that vfAnalyst provides, but then combines that with specific system knowledge to create multi-threaded code for multicore x86-based systems. Software engineers will be able to fully explore alternative partitions, mapping options, and libraries and select a solution from a cost-benefit curve. The tool can then either automatically implement that solution in a fraction of the time it would take to do manually or, if the user prefers, give specific instructions on how to implement the solution manually. vfSoftware can also be used to improve the performance of existing multi-threaded code.
Like vfAnalyst, vfSoftware also makes use of the cloud, which will allow more thorough design exploration than would be possible on all but the largest private computer farms. Adds Beunder, “The cloud computing model reduces capital costs for users, enables designers to work wherever there is web access, and facilitates cooperation across design teams, wherever they’re based. It is particularly attractive to small- and medium-sized companies.”
Mike Beunder, Martijn Rutten, Paul Stravers and Jos van Eijndhoven founded Vector Fabrics in 2007 with the goal of finding ways of making multicore programming easier for non-specialists across a wide range of applications. vfAnalyst and vfSoftware are the first of a series online tools for multicore processor code development that will bring increasing levels of functionality and automation. Vector Fabrics, based in Eindhoven, The Netherlands, is backed by Point One Innovations and the Technostarters Fund, both based in Eindhoven.
vfAnalyst is available now at for an introductory subscription fee of €85 per month. vfSoftware will be available later in 2010; its pricing has not yet been announced.

The Kontron OM6060 lowers costs and increases the versatility of MicroTCA platform development

June 29, 2010

Multiple fabrics plus processor and IO AdvancedMC module configurations
Kontron announced today the Kontron MicroTCA platform OM6060, a compact and modular development platform that is configured for the design, evaluation, and test of small, compact, and highly integrated multiprocessor systems.
The Kontron MicroTCA platform OM6060 is targeted as a solution for prototypes in test equipment, packet processing, and industrial applications. The chassis is 3U high, 250 mm deep, and 156 mm wide. It contains an AC power supply and fans with airflow from below the AdvancedMC slots. The OM6060 can accommodate up to six mid-size AMCs, one full-size MicroTCA Carrier Hub, and supports multiple PCIe, GbE, and SRIO configurations. Developers benefit from an increased flexibility in MicroTCA platform development, which helps them in finding an ideal solution for specific application needs in a shorter time, thus reducing development efforts, time to market and total cost of ownership.
The Kontron OM6060 supports multiple CPUs and I/O-boards over PCI Express (PCIe) without the need of an extra PCIe fabric switch, helping to reduce system costs. PCIe fabric clocks are generated on the Kontron OM6060 backplane. The compact MicroTCA platform also provides Ethernet connectivity to all AMCs. In such configurations an Ethernet switch is located on the MCH. Depending on the level of Ethernet features required, Kontron offers a low-cost unmanaged MicroTCA Carrier Hub, the Kontron AM4901, or a fully featured MCH with carrier grade switching and management features, the Kontron AM4904.
For packet processing applications, the Kontron OM6060 provides extra direct Ethernet links between AMC slot 1 and four adjacent AMC slots, which can be used by an AMC packet processor, such as the Kontron AM4204 or AM4210. 10GbE fabrics and switches are not required, which reduces system complexity and board count, leading to overall reduced costs. Alternatively, the Kontron OM6060 can be used with high-speed SRIO links in point-to-point configurations between adjacent AMCs.
If Ethernet connectivity is not needed, costs can be reduced by using a MicroTCA Carrier Management Controller module (MCMC-module) on the backplane. The AMC bays are fully compliant with the AMC standards and the MicroTCA standard, so any standard compliant AMC may be used. Customer specific backplanes for OEM series production are available on request.
These multiple configuration options over the backplane make the Kontron MicroTCA platform OM6060 a perfect fit for a wide range of applications.

For more information on the Kontron MicroTCA platform OM6060, please visit:

For more information on the Kontron MCH AM4901, please visit:

For more information on the Kontron AM4204 and AM4210, please visit:

For more information about MicroTCA, please visit:

For more information about AMCs, please visit:

Optimized COM Express Cooling Solutions allow 60°C Ambient Temperature

June 29, 2010

MSC Vertriebs GmbH now offers various cooling solutions for its high-performance COM Express™ module families CXB-GM45 und CXC-GS45. A special feature is the spring mounted suspension of the cooling element, which offsets the height difference of various processor types and ensures a tolerance-free adaptation to the component. As a result, an optimal cooling of the integrated Intel® Core™2 Duo processors including the T9400 high-end version can be achieved even up to an ambient temperature of 60°C.
The passive cooling solution is designed for applications with sufficient airflow around the computer-on-module, for example, by an internal system fan. The aluminum heat sinks are available in various heights and in sizes of 125mm x 95mm for the CXB-GM45 module family and with dimensions of 95mm x 95mm for the more compact CXC-GS45 modules. If there is a need for active cooling, various fan kits for mounting on the heat sinks are available. In this case, an 80mm x 80mm fan is offered for the CXB-GM45 modules and fans with dimensions of 70mm x 70mm are used for the smaller CXC-GS45 modules.
Furthermore, MSC provides heat spreaders with dimensions of 95mm x 95mm for the CXC-GS45 COM Express™ modules. These heat spreaders have a direct thermal contact to the components with the highest power dissipation.
Depending on the customer’s requirements, MSC ships the powerful CXB-GM45 and CXC-GS45 COM Express™ modules with different single and dual core 45nm processor types. Full desktop computing performance can be achieved with the CXB-GM45 module based on the Intel® Core™ 2 Duo CPU T9400 with 2.53GHz and 1066MHz front side bus. The dual channel DDR3 memory (two SO-DIMM sockets) with a total capacity of up to 8 GB provides high computing performance and low power consumption on this COM Express™ board. The Intel® GM45 chipset integrates the 4500MHD Mobile Intel® Graphics Media Accelerator with Intel® Clear Video Technology supporting DirectX10 and OpenGL 2.0. The Intel® GS45 small form factor chipset used on the CXC-GS45 modules consists of the Graphics and Memory Controller Hub (GMCH) and Intel® Enhanced I/O Controller Hub (ICH9-M) can drive two displays with a maximum resolution of 2048 x 1536 pixels.

Kontron OM6090D/OM7090D: MicroTCA robust platforms for multicore processing and 10 Gbit/s switching

June 29, 2010

Modular 6U platforms for up to nine AdvancedMC modules
The new, robust Kontron MicroTCA platforms OM6090D and OM7090D, which conform to MTCA.1, are specifically designed for high-end AdvancedMCs and feature an outstanding 10 Gbit/s Ethernet switched backplane enabling the highest data flow rate. In their maximum configuration, both systems can be fitted with up to 36 Intel XEON processor cores and a full 216 GB of RAM.
The modular 19-inch 6U MicroTCA platforms are redundant and compliant with the MTCA.1 specification for applications with the highest demands for robustness, availability, and performance. Applications include infrastructure nodes for mobile telephony, public safety engineering, medical, and military. Typical end-point applications include “Network in a box” or Rural Utilities Service (RUS) for rural and remote communication systems supporting CDMA, GSM, 3G and VoIP across HLR/HSS, RNC, and Gateway applications. The Kontron platforms are also ideal for Rapidly Deployable Mobile Networks, radar, sonar, and video data processing. These applications will benefit from the densely-packed computing power of hot-swappable AdvancedMC modules and board-to-board dual-star switching beyond 1 GBit/s.
The Kontron MicroTCA platforms OM6090D and OM7090D are based on the same compact chassis (266 x 428 x 365 mm), which is equipped with four rear-mounted extraction fans. Both MTCA.1 compliant platforms provide nine double-width slots for AdvancedMC modules and two slots for redundant MicroTCA Carrier Hub (MCH) configurations (up to 80 Watts). The Kontron OM6090D supports up to three pluggable AC-PSUs offering load balancing. For redundant power management, the Kontron OM7090D can be configured with two (one active + one standby) or three (two active + one standby) power management modules.
Equipped with Kontron AdvancedMC modules, OEM customers are able to obtain pre-validated application-ready platforms from Kontron at any time and all from a single source, which drastically reduces their time to market. Dedicated modules for the platforms are the Kontron MicroTCA Carrier Hub AM4910, which supports 10 GbE Ethernet switching and CPU modules such as the Kontron AdvancedMC processor module AM5030 (Intel Xeon processor LC5518) or the Kontron AdvancedMC processor module AM5010 (Intel Core2 Duo). The AMC slots can also accommodate Kontron’s AdvancedMC storage module AM5500, a MTCA.1 module with up to 1 Terabyte storage capacity that can also be fitted with extremely robust solid state drives (SSD) as an alternative to two 2.5" SATA HDDs. The module is ideal for applications that demand a high resistance to shock and vibration. This allows the Kontron OM6090D and OM7090D to be configured as extremely robust storage systems with a capacity of up to 9 Terabytes. Further customer-specific AdvancedMC implementations can be made on demand using the 10 GbE, 1 GbE, PCIe x4 and SATA supporting backplane.

The new MTCA.1 compliant Kontron MicroTCA platforms OM6090D and OM7090D are available now. For more information on the Kontron OM6090D and OM7090D, visit:

For more information on Kontron integrated MicroTCA™ platforms, visit:

For more information on Kontron AdvancedMC™ modules, visit:

DSM Computer's modular NanoServer® family is now complete

June 29, 2010

With the NanoServer® E6-A, the DSM Computer GmbH has now completed its new embedded product line that consists of the three housing variants E8, E6 and E4. The compact industrial systems available in various performance classes are differentiated by the number of free slots. In addition to the NanoServer® E8 without slot that is just 58-mm high, the NanoServer® E4 provides a PCI or PCI Express™ slot. The NanoServer® models E6 provide two PCI slots or one PCI and one PCI Express™ slot.
The robust NanoServer® E8-A, E6-A and E4-A based on the energy-saving Intel® Atom™ N270 processor with the Intel® 82945GSE/ICH7M chipset are designed for energy-efficient applications. The NanoServer® E8-GM45 and E4-GM45 are predestined when more processor and graphical performance is required. The high-end computers integrate an Intel® Core™ 2 Duo processor and the Intel® GM45/ICH9M chipset with high-performance Intel® Graphics Media Accelerator GMA 4500MHD. Thanks to its video decoder capability, the graphical controller can decode high-resolution HD videos in AVC/VC2/MPEG2 format and so remove significant load from the processor.
The optimized housing of the NanoServer® has an easy to maintain screwed-on base cover that allows access to the internal Compact Flash socket, the memory expansions and the hard disk. Depending on the variant, the embedded systems are equipped with a wide range of standard interfaces. The E8-GM45 offers, for example, not only two GBit Ethernet ports, but also eight USB 2.0 (four external and four internal), four serial ports, audio, VGA, DVI (optional), IDE and serial ATA for SATA II 300 devices. The housing provides space for a 2.5-inch hard disk / SSD; the E4 and E6 models even offer two installation bays for HDD/SSD devices.
Thanks to their identical footprint of just 204 x 226 mm and standardized fastening points, all NanoServer® models based on an industrial motherboard can be replaced when necessary. If DSM's standard products do not satisfy the customer's requirements, the embedded systems can be customized for the associated application, even for small unit counts. Because the processor modules and chipsets used in the NanoServer® family belong to Intel®'s Embedded Roadmap, DSM can guarantee the long availability of at least four years for their systems. CE-conform design, burn-in and a two-year warranty are features of all NanoServer® models.

3U CompactPCI IPv4/v6 Kontron Gigabit Ethernet Switch CP3923 with superior price & performance

June 29, 2010

Kontron announced today the latest member of the 3U CompactPCI product family for IPv4/v6 communication networks and network-centric applications: the Kontron Gigabit Ethernet Switch CP3923. With up to 16 Gigabit Ethernet ports, the Kontron CP3923 fully managed switch is a cost-effective high-performance solution for harsh environments. The target markets include networking, transportation, aerospace, military and automation.
“The new 3U CompactPCI switch is designed to meet the growing demand for high performance IPv4/v6 Ethernet switching for rugged intra- and inter-system communications. With its implemented Kontron Embedded Network Technology, that unifies an advanced feature set and a wide range of operational interfaces across multiple form factors, the Kontron CP3923 enables system designers to build new applications most efficiently”, says Sandra Korsinek, Product Manager for 3U CompactPCI at Kontron. “The extensive management capabilities of the Kontron CP3923 plus our configuration services for OEM applications reduce customers’ hardware and software design efforts, thus minimizing costs and time-to-market”.
The Kontron Gigabit Ethernet Switch CP3923 is a fully managed Layer 2/3 Gigabit Ethernet (GbE) switch offering IPv4 routing and optional IPv6 routing as well as full management capabilities. It supports powerful CLI, Telnet, Web, and SNMP management interfaces to configure the entire set of protocols and parameters including Layer 2 and Layer 3 (IPv4/v6) protocols, Multicasting, QoS, and Security. For applications requiring higher bandwidth, it also supports link aggregation. On top of that, the Kontron CP3923 maximizes the reliability of rugged COTS applications by supporting Intelligent Platform Management (IPMI) and hot-swap capabilities.
The base configuration (CP3923-8C) supports eight GbE ports via RJ45 and eight GbE ports via rear I/O to ensure highest connectivity capabilities and broadband flexibility. Two additional versions directly target transportation and mobile applications, providing four (CP3923-4M) or eight (CP3923-8M) Fast Ethernet ports via M12-D connectors. All versions support eight GbE via rear I/O. To have access to the 8x GbE ports routed to the rear, a special Rear Transition Module is available.
Designed to meet the highest reliability and ruggedization requirements of harsh environments, the new Kontron CP3923 is compliant with the EN 50155 railway standard and offers an extended operating temperature range (E2) of -40°C to +85°C. Additionally, the use of soldered components ensures resistance against the typical effects of shock and vibration. For even harsher environments a rugged conduction-cooled version is planned.
The Kontron Gigabit Ethernet Switch CP3923 with Kontron Embedded Network Technology is available now. The Kontron Embedded Network Technology offers a unified advanced feature set and operational interfaces across multiple form factors including CompactPCI, VPX/OpenVPX, VME, MicroTCA, and ATCA. This enables OEMs to efficiently re-use their switching expertise, improving time-to-market, and total-cost-of-ownership. Kontron Embedded Switches are designed for maximum ease of use and support easy configuration and operation in the field.

For more information on the Kontron Gigabit Ethernet switch CP3923, please visit:

For more information on CompactPCI, please visit:

New Startup Bundle for Atmel's Cortex-M3 SAM3S Family

June 29, 2010

MSC Offers a Complete Development System
The unique AT91SAM3S-Startup package consists of the evalboard ATSAM3S-EK (ATSAM3S4C MCU in the Cortex-M3 Rev2 architecture with 64 MHz).
Integrated are a full speed USB port, SD card interface, 1 Msps 12-bit analog-to-digital-converter (ADC), 12-bit DAC, 256 K Flash, 48 K SRAM memory and USB JTAG-ICE interface.
On-board are capacitive touch-buttons and sliders, which will be supported by Atmel’s free QTouch library.
Furthermore the evalboard features a QVGA color TFT display with resistive touch-panel and headphone output.
For further information please contact MSC Vertriebs GmbH.

High-performance IPv4/IPv6 Kontron Gigabit Ethernet Switch VX3910 for VPX and OpenVPX platforms

June 29, 2010

The new Kontron Gigabit Ethernet Switch VX3910 offers 3U VPX (VITA 46.x) and OpenVPX (VITA 65) platforms Enterprise-Class Switching functionality with a total of 28 Gigabit Ethernet ports and advanced management features. With its implemented Kontron Embedded Network Technology, which offers the same advanced feature set and operational interfaces across multiple form factors, it simplifies IPv4/v6 inter-and intra-platform networking, reducing both time-to-market and development efforts for open application-ready and long-term available COTS platforms.
The non-blocking fully managed L2/L3 Gigabit Switch Kontron VX3910, with its 20x Gigabit ports to the backplane offers the highest port density for the implementation of various network topologies in 3U appliances. Four additional 2.5-Gigabit ports to the backplane simplify a redundant system architecture with multiple switches with no single point of failure. The four 1000 Base-T uplinks on the front panel, one dedicated for out-of-band management, expand the range to a total of 28 ports. The new Kontron Gigabit Ethernet Switch VX3910 is available in an air-cooled version for ambient temperatures from 0°C to +55°C and in a rugged conduction-cooled version for the extended temperature range from -40°C to + 85°C.
The Kontron VX3910 allows flexible implementation of network-centric situational-awareness and High Performance Embedded Computing (HPEC) applications in markets including military, medical, energy, and in autonomous systems such as UAVs and AUVs. Also, complex Vetronics applications (Vehicle Electronics), extremely rugged embedded multiprocessing systems, as well as Rapidly Deployable Networks in VPX and mixed VPX/VME environments are among the target applications.
The Kontron Gigabit Ethernet Switch VX3910, with its single-chip Broadcom switching solution offers an unparalleled price/performance ratio. Equipped with an AMCC PowerPC switch controller and individually customizable software environment and comprehensive firmware, it is flexibly configurable to the individual needs of customer specific installations.
The Kontron VX3910 supports all relevant standards, such as L2 and optional L3 switching, including extensive VLAN support with VLAN tagging (IEEE 802.3ac), dynamic VLAN registration with GARP/GVRP (IEEE 802.1Q) and Protocol based VLANs (IEEE 802.1v) as well as QoS (IEEE 802.1p). It also supports numerous optional routing protocols such as OSPFv2, RIPv2, VRRP, VLAN routing and DHCP relay for an accessible network of different network segments.
Highest availability is guaranteed through in- and out-of-band management via SNMP, Telnet and command line interface via the frontside10/100/1000BASE-T (RJ-45) ports. Also available for management and debug are the EIA-232 ports on the front panel, which can also be routed to the backplane. Two master/slave capable I²C buses allow communication with VPX System Monitoring Boards (SMB).
The Kontron Gigabit Ethernet Switch VX3910 is available now. It represents a new member of the highly successful family of Kontron embedded switching products with implemented Kontron Embedded Network Technology. The Kontron Embedded Network Technology provides unified, advanced features and operational interfaces across multiple form factors including ATCA, MicroTCA, CompactPCI, VME and now also VPX/OpenVPX. This enables OEMs to efficiently re-use their switching expertise, improving time-to-market and total-cost-of-ownership. Kontron Embedded Switches are designed for maximum ease of use and support easy configuration and operation in the field.

For additional information about the Kontron Switch VX3910, please visit:

For additional information about VPX, please see:

For additional information about rugged COTS, please see:

KIOSK EUROPE: DSM Computer presents flexible full HD solutions

June 29, 2010

For the KIOSK EUROPE EXPO 2010, DSM Computer GmbH has extended its comprehensive product portfolio of embedded computer systems for sophisticated kiosk and digital signage solutions with full HD functionality. In addition to a special embedded PC module for the integration in various displays, the high-performance NanoServer® E8-GM45, the robust BookSize and compact PicoBox PCs can be used as external monitor control computer.
Christian Lang, marketing manager at DSM Computer, said: "For more than three years we have also been concentrating on the rapidly growing POI/POS and digital signage market where we can offer a wide range of solutions for the various applications. In addition to our standard systems, we are also developing custom solutions for the multimedia area. At the trade show, we exhibit a very compact computer with PCI Express™ x16 graphic card for controlling information steles and large format displays."
DSM Computer's full HD-capable DSM Public Display systems combine a high-performance embedded-PC module for the display control with a large-format TFT monitor. The DSM computer module that is only 41 mm high can be used for any screen size and can be inserted without extensive cabling and without additional power supply in the slot provided in the display. Currently, various TFT monitor types of the NEC® MultiSync® and MULTEOS® series with a screen diagonal size of 102 cm (42 inch) or 117 cm (46 inch) are supported. On request, public display systems with 165 cm (65 inch) diagonal monitors can be supplied. In addition, DSM also offers Able Design displays with 119 cm (47 inch) or 107 cm (42 inch) diagonal size, optionally available with IP54 (Front IP65) degree of protection, that are particularly suitable for outdoor applications.
DSM's 58-mm high NanoServer® E8-GM45 can be used to control high-resolution full HD displays with a maximum resolution of 2048 x 1536 pixels. As an option, two monitors can be supported independent of each other. Despite its extremely compact design, its integrated Intel® Core™ 2 Duo processor with Intel® GM45/ICH9M chipset allows the embedded system to provide high computing and graphical performance. The GMA 4500MHD on-board graphical controller with Intel® Clear Video technology can decode high-resolution HD videos in the format AVC/VC2/MPEG2 and so relieve load from the processor. Because no dedicated graphic memory is present, depending on the associated requirement, the chipset uses a dynamic part of the main memory that can have a maximum capacity of 2 x 4 GB.
The robust PicoBox operates without fan and with dimensions of just 180 x 180 x 55 mm can be installed flexibly in the POI/POS system. In addition to the DVI and the VGA interface used to connect a display, USB 2.0 ports, GigaBit LAN, serial outputs and a PS/2 interface provide a high degree of flexibility. Thanks to a separate interface cover plate, further interfaces can be made available externally. The compact DSM BookSize computers that differ with regard to processor performance and number of interfaces are also suitable for the high-performance control of public displays. Such computers provide a slot and a built-in AC power pack.

IEC60601-1 Compliant Kontron PCIe Medical LAN Card

June 8, 2010

Gigabit LAN card for direct connection of IT equipment to medical devices
Today Kontron announced the PCIe Medical LAN Card, an IEC60601-1 compliant PCIe Gigabit Ethernet card, which can be used for the direct network connection of conventional IT equipment to medical devices. With this card, expensive medical LAN isolators, which otherwise would have to be inserted between the LAN port and a medical device, are no longer needed lowering costs and simplifying overall system design
The new Kontron PCIe Medical LAN Card will find applications in hospitals, rehabilitation centers, doctor's offices, and anywhere where medical devices are connected to conventional workstations or to high-availability archiving, backup, and storage solutions. In order to transmit data between medical devices and systems via Ethernet to non-medical devices in an office or hospital network, the LAN card needs a galvanic separation according to the IEC60601-1 standard, which has already been engineered into the new Kontron PCIe Medical LAN card.
The PCIe 2.0 compliant Kontron PCIe Medical LAN Card is suitable for installation in any PCI Express x1 compatible card slot. Matching slot brackets for full-height or low-profile assembly are included. The long-term available Kontron PCIe Medical LAN Card features either one or two isolated Ethernet 1000Base-T interfaces on RJ45 connectors. Both variants are based on the Intel 82574L GbE controller, which ensures a particularly high level of compatibility and high transfer rates.

The Kontron PCIe Medical LAN Card is available now. Operating system support is provided for all Windows operating systems from Windows XP/Windows 2000 on and also for Linux Kernel from 2.4.18 on.
For more information on Kontron PCIe Medical LAN Card, please visit:

For more information on Kontron's solutions for the medical market, please visit:

Kontron CompactPCI processor board CP6002 brings latest Intel Core i7 performance to 6U systems

June 8, 2010

Higher performance-per-watt ratio for 6U CompactPCI
Eching, Germany, June 08, 2010 - Today Kontron introduced the 6U CompactPCI processor board CP6002 based on the latest Intel Corei7 mobile processor technology. It is designed to bring leading-edge performance with low power consumption and low heat dissipation to a broad range of applications in the communications, military, aerospace, medical, industrial and monitoring systems markets.
With the 2.53 GHz Intel Core i7-610E and the LV 2.0 GHz Intel Core i7-620LE, the long term available Kontron CP6002 not only speeds up multiprocessing tasks via hyper-threading technology (HTT), but also processes single-threaded tasks much faster thanks to the new Intel Turbo Boost technology. This allows for a clock speed of up to 3.33GHz without exceeding the defined thermal design power (TDP) and without the need to oversize the entire system for peak loads. On the memory side, up to 8 GB of soldered DDR3 1066 MHz ECC memory ensures data accuracy for demanding and safety-critical applications like radar, sonar, or imaging systems. In addition to the CompactFlash socket for rugged, industrial grade flash modules, up to 32 GB of NAND Flash (64 GB upon availability) are possible via SATA interface, which are able to hold complete operating systems or application code, substantially increasing overall system speed and availability.
"The highly-integrated Intel Core i7 architecture on 6U CompactPCI allows for overall performance increase of 30 to 60% and nearly three times the graphics performance compared to previous processor platforms," says Reiner Grübmeyer, Product Manager for 6U CompactPCI at Kontron.
For maximum application flexibility, the Kontron CompactPCI processor board CP6002 comes with six Serial ATA interfaces with RAID support, one front and two rear high-resolution graphics interfaces (VGA/DP/HDMI) and up to two PMC/XMC slots, enabling more compact and cost-efficient system designs by omitting previously required add-ons such as PMC carriers, graphics and/or RAID CPCI-boards. In addition, six USB 2.0 ports are available on the board, two on front I/O and four on rear I/O. Further interfaces include two COM ports, one RS-232 port implemented as an RJ-45 connector on the front panel and routed to rear I/O as well as one RS-422 port on the rear I/O.
The Kontron CP6002 is offered in three versions, with either one (CP6002-R1) or two XMCs/PMCs slots (CP6002-R1-MC and CP6002-R2-MC). The Kontron CP6002-R1 can further accommodate an onboard 2.5" SATA HDD/SSD and provides two Gigabit Ethernet ports, one VGA (CRT) port, one COM port and two USB ports on the front panel. The Kontron CP6002-R1-MC and CP6002-R2-MC provide one Gigabit Ethernet port, one DisplayPort (alternatively RS232) and two USB ports on the front panel. The Kontron CP6002-R1 and CP6002-R1-MC are designed for standard application environments in air-cooled environments, whereas the ruggedized Kontron CP6002-R2-MC is designed for high shock and vibration environments (as defined in VITA 47 EAC3/EAC6), an extended operating temperature range (-40° C to +70° C.), and provides support for two conduction-cooled XMCs/PMCs. The R3 version (available on project request) is fully conduction cooled and meets the VITA 47's ECC4 requirements.
The Kontron CP6002 supports a configurable 64-bit/66 MHz PCI or PCI-X, hot swap CompactPCI interface. When installed in the system slot, the interface is enabled, and when installed in a peripheral slot, the board is isolated from the CompactPCI bus. Safety and security features via a optional Trusted Platform Module (TPM) 1.2, two redundant firmware hubs (failover) and Intelligent Platform Management Interface (IPMI) are supported as well.
The Kontron CompactPCI processor board CP6002 runs with VxWorks 6.8, Linux (RedHat), Microsoft Windows 7, Windows XP, XP embedded or Windows Server 2003 or 2008. Highly integrated support packages support all onboard hardware devices, and also specific features like hot swap ability, IPMI, power, and thermal management enabling effortless integration among scalable multi-CPU systems.

Samples of the Kontron CP6002 are available now. Full production is scheduled for Q3 2010.

Further information about the Kontron CompactPCI processor board CP6002 is available at:

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Microchip expands DAC range and adds flexibility

June 3, 2010

Microchip announces the MCP4801/2, MCP4811/2 (MCP48XX) and MCP4901/2, MCP4911/2 (MCP49XX) Digital-to-Analogue Converters (DACs). The new products expand the Company's portfolio of DACs with single- and dual-channel 8- and 10-bit devices featuring an SPI communication interface, as well as internal and external voltage-reference options. The MCP48XX family has an internal voltage reference, while the MCP49XX family accepts an external voltage reference. These DACs are appropriate for applications in the consumer (e.g., home appliances, LCD displays, computer peripherals); industrial (e.g., control systems, motor control, metering); and medical markets (e.g., ultrasound, ECG, sensor calibration), among others.

Stand-Alone LIN 2.1/SAE J2602 Transceivers from Microchip

June 3, 2010

Microchip announces the MCP 2003 and MCP2004 (MCP 2003/4) stand-alone LIN transceivers. These AEC-Q100-certified devices are 3rd party-LIN/ J2602 approved and satisfy the stringent requirements of automotive manufacturers, worldwide. The transceivers are compliant with the LIN Bus 1.X/2.0/2.1 and SAE J2602 standards, and feature industry-leading ESD and EMC performance for reliable communication in extremely harsh environments. Their current-consumption ratings are among the lowest in the LIN transceiver market, allowing for extended battery life and more efficient non-ignition-switched applications. The market momentum for LIN continues to show strong growth and acceptance in all regions around the world. The MCP 2003/4 family represents Microchip's third generation of LIN/ SAE J2602 transceivers, following the Company's previous-generation MCP2021/2 transceivers with an integrated voltage regulator.

Microchip Technology extends mTouchTM technology

June 3, 2010

Microchip announces the availability of mTouchTM Projected Capacitive Touch-Screen Sensing Technology, the first in a series of patent-pending releases supporting projected capacitive touch-screen solutions across the company's portfolio of 8-, 16- and 32-bit PIC® MCUs. The technology announcement is supported by the release of the mTouch Projected Capacitive Development Kit, featuring the first device to implement the technology; the 8-bit PIC16F707. Projected capacitive touch sensing extends resistive and existing capacitive touch sensing technology to include multi-touch and gesture sensing, enabling users to implement robust glass-front user interfaces that simplify user interaction. Typical applications include global positioning systems, thermostats, mobile handheld units and other devices that use smaller displays with a finger input.

Atmel maXTouch Now Enabling the Big Screen

June 3, 2010

Atmel® Corporation announced its maXTouch(TM) technology can enable advanced capacitive touch functionality for large format touchscreens. Rapidly becoming the favored touch technology solution for smartphones, Atmel's maXTouch solutions now support large touchscreens up to 15 inches for emerging products including touch-enabled tablets, smartbooks, mobile Internet devices (MIDs), Netbooks, PC notebooks, and a range of industrial applications.
With true unlimited touch functionality and stylus support, the maXTouch technology will enable exciting new applications and user interactions on one screen. The chip technology, combined with proprietary algorithms, will offer higher performance and faster response times to provide a better user experience.

Mitsubishi Electric and Infineon Technologies team up to serve the global power electronics industry

June 3, 2010

Infineon Technologies AG and Mitsubishi Electric Corporation, agreed to establish a service agreement by which they will both serve the industrial motion controls and drives market worldwide as sources for the advanced IGBT module packages SmartPACKs and SmartPIMs. This revolutionary package concept, recently developed by Infineon Technologies, will be available with the latest generation of power chip technologies from the two leaders. Under this agreement, Mitsubishi Electric will market its latest generation power chips of various ratings (current range: 15A - 200A, voltage class: 600V & 1200V) in the Smart-1,-2 &-3 housings of Infineon Technologies. Infineon Technologies, the creator of the new SmartPACK/PIM module concept, will continue to manufacture and supply the same range of fully compatible products using its own chip technologies and module manufacturing.

Bluetooth BTM series modules in TME offer

June 3, 2010

TME offer includes Bluetooth modules from Rayson designed for wireless applications. The offer comprises BTM-112, BTM-222 and BTM-330 modules. They conform to the Bluetooth standard Ver. 2.0 + EDR (2 Mb/s and 3 Mb/s, their carrier frequency amounts to 2,402 ... 2,480GHz and the operating voltage is 3.3V.
The BTM-112 and BTM-330 modules RX sensivity is -80 dBm and the module is a Max.4dBm (Class 2) module at 50W impedance. The modules provide communication over a distance of up to 10m.
The BTM-222 module features a receiver of -86dBm sensivity and a transmitter of 18dBm max. power (class 1), which allows for wireless communication over a distance of up to 100m.
Control of the modules depends on the implemented protocol. In BTM-112 and BTM-222 it is SPP (Serial Port Profile) with AT command sets. With their use it is possible to easily establish a wireless link substituting for a standard RS232 connection. AT command sets are not available in the BTM-330 module though, as the module utilizes the HCI protocol (Host/Controller Interface).
The control of the module is realized by the use of the USB or UART interfaces. Additionally, BTM-112 and BTM-222 modules provide the PCM interface for voice CODEC.
All modules are fitted for PCB mount.
Their dimensions equal: 25 × 14,5 × 2,2mm (BTM-112), 28,5 × 15 × 2,8mm (BTM-222) and 14 × 12 × 2,2mm (BTM-330). BTM-222 and BTM-330 modules meet the requirements of the RoHS Directive.

For more information:
Transfer Multisort Elektronik
93-350 Lodz, ul. Ustronna 41
Tel.: 042 645 54 44
Fax: 042 645 54 70

New developer portal: fast integration of industrial Ethernet Interfaces

June 3, 2010

Innovasic Semiconductor's new web-based Developer Portal provides access to a complete Industrial Ethernet design solution that includes development tools and personalized technical support. The portal is a secure and private workspace with tutorials, design and conformance testing resources, online access to evaluation hardware, comprehensive FAQs, and direct technical support. Having these resources in one place allows designers to quickly assess and integrate an Industrial Ethernet interface into their product. The Developer Portal supports Innovasic's RapID™ Platform, which is an entire Industrial Ethernet design platform that can be downloaded and installed through the portal. The RapID Platform includes software, protocol stacks and technical documentation, as well as electronic copies of the schematics and Gerber layout files. Circuit designers can use these files to add Industrial Ethernet connectivity to their products.

HOPE RF communication modules from Hope Microelectronics

June 3, 2010

Achieving full functionality of modern electronic devices - not only professional equipment - often involves wireless communication between devices. These days, due to the availability of miniature wireless communication modules this problem becomes easy to solve.
Hope Microelectronics is one of the world leaders in the production of wireless communications modules which covers ISM bands.
TME offers transmitters, receivers and transceivers for bands 433 and 868 MHz. They provide long distance communication: up to 300 m for 433 MHz version and about 200 m for 868 MHz at a transmission rate of 1,2 kb/s and bandwidth 134 kHz.
This distance can be extended (to about 3000 m) with the use of transceivers with increased output power of transmission channel (RFM12BP/xxx series). The transmission parameters are set by external control system (for example microcontrollers). In favourable environment conditions, these modules can achieve a transmission speed of up to 115,2 kb/s, and by the application of an external filter this speed can even be increased up to 256 kb/s.
The modules are available in two versions: DIP and SMD, and they are ready for use just after installation - no tuning is required. Due to their small dimensions (about 16x16x2 mm for transmitters and receivers, 40x20x4 for increased power transceivers) the modules can be easily applied in Your very own constructions. Also hardware implementation isn't a problem here. Data exchange with a wireless module is carried out over the SPI interface, which is available in the majority of commonly used microcontrollers.
Power supply of the modules is adapted to currently applicable standards (from 2,2 to 3,8V). The modules are characterized by very small current consumption, and the possibility to switch to stand by mode (in this mode current consumption is as small as 0,3mA) when the transmission is off.

For more information:
Transfer Multisort Elektronik
93-350 Lodz, ul. Ustronna 41
Tel.: 042 645 54 44
Fax: 042 645 54 70

Win a Microchip nanoWatt XLP 16-Bit Development Board!

June 3, 2010

“EP&Dee” is offering its readers the chance to win a Microchip XLP 16-bit Development Board. The XLP 16-bit board permits users to explore and evaluate extreme low-power features, and learn low-power software and hardware techniques. It provides a low-cost, highly configurable development system for Microchip's extreme low power 16-bit PIC24F microcontrollers which feature sleep currents down to 20nA and various headers are available to measure both microcontroller and component power consumption.
The board supports development on PIC24F16KA102, PIC24FJ64GA102 and PIC24F64GB002 families of MCUs. The board can be powered by over five sources including batteries and energy harvesting modules and supports a variety of common components that can be selectively enabled. It was also expandable through its modular interface, providing for the addition of advanced interfaces and connectivity methods. The board supports a wide voltage range; from 1.8V to 5.5V.
The XLP 16-Bit Development Board functions as a demonstration platform on initial power-up. The included demonstration software takes a temperature measurement, datalogs information to the serial data EEPROM and displays information to a host PC via a USB connection. Additional software is provided to demonstrate
low-power techniques and IC interface routines.
Today's portable products need to operate longer with less power and more functionality. Microchip's nanoWatt XLP microcontrollers contain features that are ideally suited for applications such as remote sensors powered by energy harvesting or sealed-battery applications, which can run for more than 20 years from a single battery. nanoWatt XLP technology gives designers the flexibility to customize their applications for the lowest power consumption through multiple internal wake-up sources, such as Real-Time Clock and Calendar alarm, Brown-Out Resets, interrupts and Watch-dog Timers, all while maintaining the I/O states.

For your chance to win a Microchip XLP 16-Bit Development Board with a preprogrammed PIC24F16KA102 microcontroller installed, enter your details in the online entry form: