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AMD makes high-end PCI Express® capable graphics available long-term
The level of performance called for in medical imaging and simulation is often so high that even the latest multicore processors find it difficult to keep up. An efficient alternative to the supercomputers otherwise needed to meet the kind of requirements presented by medical diagnostics and therapy can be found in today’s extremely high-performing general purpose graphics processing unit (GPGPU) technology and tools with which the massive parallel computing power of modern graphics cards is easily channeled. AMD now makes this technology available long-term for the embedded market in the form of the ATI Radeon™ HD 5770 and the new AMD Radeon E6760 GPGPU.
The thirst for more performance has been driving processor developments from one extreme to the next — faster clocking, more bit width and ever smaller fabrication volumes are meant to further optimize the performance rewards. The next step in the x86 market was the introduction of multicore technology, consuming about the same power but multiplying performance. Nevertheless, even the new multicore processors are often no match for applications in which you want to process large quantities of data as fast as possible. Because in imaging diagnostics such as MRT and CT, for in-stance, using solutions set up on multicore technology may still mean having to wait several minutes, if not hours, until the final image data appear, depending on the volume of data involved and the complexity of processing.
This is contrary to the need to process medical image data as speedily as possible for purposes of diagnosis and treatment, yet still visualize them with extremely high resolution — in applications enabling diagnosis of breast cancer, for instance, where you want fast readout of images in high detail. Other applications that make extremely high performance demands on the supporting hardware include rebuilding images for high-speed 3D X-ray computer tomography. This calls for conversion of X-ray projection data into non-overlapping, three-dimensional slices of an object of interest using image reconstruction algorithms, which needs to be done as fast as possible, of course. Simulation is one of the most ambitious medical uses for CPUs besides diagnostic applications — take virtual microscopy, used in pharmaceutical research, for example: uniting chemical, physical and mathematical formulae in simulation software, this employs complex algorithms to simulate molecules and the way in which they react with one another.
What is common to all these applications is that performance demands on the processor cores are extremely high, and even the latest multicores seldom fully live up to them. Of course it is possible to combine a number of multicore processors in a single high-performance cluster for such compute-intensive and time-critical applications, but the cost of purchasing and operating that kind of super-computer plus its infrastructure is huge.
GPU technology is developing parallel
But parallel to CPU technology there has also been fast development of graphics processing unit (GPU) technology, driven in particular by the consumer market. More frames per second, higher resolution and uniform programming interfaces have created a broad basis for use of this technology in data processing too. Because getting down to the data level, there is not really much difference between computing and displaying virtual worlds in games and visualization of raw data from a variety of sources, such as an ultrasound or coronary examination. GPUs are sometimes even better able to handle parallel and data-intensive tasks, for instance. Being restricted to specific problems without excessive management enables them to be designed so that most of the transistors are devoted to computing operations and not needed for control and caching, as is the case with CPUs. Computer scientists at universities led the way in using the huge parallel computing power of modern graphics cards. Such a degree of parallelism made the algorithms extremely complex, though, so this initially only really appealed to idealists and specialists.
With the introduction of IDEs such as the AMD Accelerated Parallel Processing SDK and programming environments like OpenCL™ as an accompaniment to OpenGL, all developers are now able to tap the performance of modern graphics processors. Diagnostic speed can be multiplied simply by the parallel computing power of modern graphics units. Combined with high-resolution and loss-free imaging, this high performance can produce incredible visualization results. Such GPGPU-enabled high-performance systems have cost benefits as well. And not just because it is less expensive to set up on a standard embedded platform with powerful graphics units as coprocessors instead of a cost-intensive supercomputer. A system like this requires less floor space and cooling infrastructure, making it highly cost-effective overall. Nevertheless, graphics card technology has had one downside, until now, that can sometimes detract from all the advantages of using GPUs in high-performance embedded computing (HPEC) applications — it has a short life. The problem facing producers of embedded systems was, therefore, the lack of high-end embedded graphics with
long-term availability.
High-end graphics for the embedded market with long-term availability
AMD offers a high-end PCI Express® capable graphics card for the embedded market with long-term availability1— the new ATI Radeon™ HD 5770 PCI Express capable graphics card as well as the new AMD Radeon E67602 embedded discrete GPU. This novel development helps provide medical apparatus OEMs the sustained design security they want for their graphics hardware too. In addition to long-term availability, OEMs can benefit from simple integration of the graphics processing unit: A PCI Express capable x16 (PEG) graphics card can easily be used in a variety of embedded platforms, from a standard server board to a high-end PICMG 1.3 backplane configuration. The new AMD Radeon E6760 embedded discrete GPU is also available in a compact MXM form factor according to the MXM 3.0 specification. But not only graphics-intensive applications can benefit from this extremely high processing capability, because the stream processors of the graphics unit can take a huge workload off the multicore CPUs in the parallel processing of different data streams. Combining these processor units in shader units enables vector processing in addition to scalar operations. This potential is easily accessed through standard programming platforms and APIs such as OpenCL™ or DirectCompute, thus simplifying and speeding up the development of an application. Turning to total cost of ownership, this type of GPGPU solution is designed to be cost efficient because systems enhanced by modular GPUs do not require multicore processors distributed over a number of server boards to produce measurable savings. Exchanging a GPU is also less complicated than replacing an entire board, be it for maintenance or to upgrade performance. Furthermore a GPU can be easily replaced long-term by a compatible and more powerful model without significantly altering the overall configuration of a system.
There are consequently numerous reasons in favor of high-end graphics hardware in medical embed-ded systems. The long-term availability of AMD solutions such as the ATI Radeon HD 5770 PCI Ex-press capable graphics card or the new AMD Radeon E6760 GPU does away with the short-term availability obstacle. AMD has launched more embedded graphics products in 2011, such as the integrated advanced processing unit (APU) solutions enabled by AMDs Fusion technology, which unites the CPU and GPU for energy efficiency on a single chip and ushers in the next generation of ultra mobile and powerful medical applications. With the widespread introduction of GPGPU technology, the hope is that it will increasingly become mainstream, cutting down the time to develop new applications.
1) The ATI Radeon™ HD 5770 graphics card offers a long-term planned availability of 3 years.
2) The AMD Radeon™ E6760 ASIC planned life is 5 years.
Long-term available ATI Radeon™ HD 5770 PCI Express capable graphics card
The ATI Radeon™ HD 5770 PCI Express capable graphics card adds long-term availability to
3) ATI CrossFireX™ ready motherboard required.
4) AMD Eyefinity technology can support up to 6 displays using a single enabled ATI Radeon™ graphics card with Windows Vista® or Windows® 7 operating systems - the number of displays may vary by board design and you should confirm exact specifications with the applicable manufacturer before purchase. AMD Eyefinity technology works with games that support non-standard aspect ratios, which is required for panning across multiple displays. To enable more than two displays, additional panels with native DisplayPort™ connectors, and/or certified DisplayPort™ adapters to convert your monitor’s native input to your cards DisplayPort™ or Mini-DisplayPort™ connector(s), are required. SLS (“Single Large Surface”) functionality requires an identical display resolution on all configured displays.
New Embedded GPU Offering Support for OpenCL™ and Six Independent Displays
The AMD Radeon™ E6760 GPU is the first of its kind to offer embedded system designers the combination of OpenCL™ support along with support for six independent displays. An advanced 3D
MXM V3.0: The modular solution for embedded graphics
Contrary to the case with PEG cards, MMX modules are mounted parallel to the carrier board, so
They offer a standardized footprint, a standard pinout and assembly concept and are also suitable as add-on components, in particular for custom designs. With its product range both in the PEG and MXM form factors, AMD covers the complete requirements spectrum for embedded modules and board-level segments. This ranges from compact, mobile devices right up to rack-mount servers, while meeting the ultimate requirement of long-term availability.
To secure the advantages in the offing, it is well worth thinking today about implementing the technology.
Aurelius Wosylus is Regional Sales Manager Europe at the AMD Embedded Business Unit
www.amd.com
A mobile advertising platform - innovative digital signage on buses
Digital signage in buses is becoming more popular among advertisers and passengers alike. For operators and advertising clients, it means dynamic content — easily changed and precisely aimed at their target groups.
The passengers themselves are presented with a wide variety of content plus interactive elements that provide entertainment while traveling. GEM Interactive has installed a mobile digital signage network with more than 450 displays in 128 buses in Slovenia’s capital Ljubljana. The digital signage specialist developed its solution using a customized box PC from local provider Tipteh that contains an AMD-enabled embedded motherboard from Kontron. Together, these elements deliver the graphics performance, long-term availability, and robustness that such digital signage solutions require.
Digital signage is a growing market
Digital signage is booming. Double-digit growth rates in 2010 are evidence of a trend that has continued into 2011. Joining the company of online media, outdoor, or “out-of-home” (OOH), advertising has become a major seller adding new impetus to the advertising market. What makes digital OOH advertising so attractive is its ability to reach the public when they are most ready to absorb an advertiser’s message. Passengers using public transportation for travel to and from work are a captive audience when waiting for a flight or a train. The same holds true when they are taking a Sunday stroll downtown. Furthermore, digital OOH (“DOOH”) is highly dynamic, quite unlike static billboard advertising.
Certain advertising campaigns can be initiated according to the time of day or triggered location based via GPS signaling. [The following data sources were used: NRB 2009 (Valicon); official media price lists; Marketing Magazin, February 2010; Data on Urbana Cards Sold (LPP — Ljubljana City Public Transport).]
New possibilities of interaction
The dynamic factor of digital signage solutions is enhanced even more by new technology. Digital signage is moving from pure information presentation to intelligent interaction with its surroundings and potential customers. For example, digital signage displays within public transportation environments can determine a person’s or vehicle’s position or location through the use if integrated GPS or mobile radio features and as a result the content of the sign can be dynamically changed to match the route that is being traveled. Retailers with places of business ahead of or close to the route can push their information to the passengers to keep them aware of their latest bargains and discounts.
By integrating interactive elements such as SMS phone numbers, web links, or 3-D barcodes with the content, advertisers can also utilize the growing spread of smart phones with internet capabilities as a means of interacting with possible customers. The latter can retrieve vouchers and the like directly on their smart phone and the retailer can then immediately judge the success of an advertising campaign.
Attractive price/performance
In addition to being highly dynamic and presenting potential for interaction, DOOH comes with an attractive price/performance ratio. Its range, depending on the number of displays and their distribution, plus the attractiveness of the content, is comparable to popular print media and can even match the impact of TV advertising. The cost to reach 1000 viewers is only about half of what would have to be invested for TV advertising for the same result, while the investment is just a tenth of print advertising.
Large-scale digital signage displays are easy to read throughout a bus and make innovative ideas for communication reality, such as interaction with passengers: using the SMS phone numbers that are shown, passengers can even text their comments on particular advertising campaigns, which then appear on the displays and can in turn be commented on by other passengers.
The special appeal of digital signage in buses
It is especially easy to reach a large and widely distributed number of potential customers on buses. Here you have a highly differentiated demographic structure, making it possible to reach those target groups that could otherwise only be addressed through specialized channels. Such channels for specific target groups can be implemented on buses in a number of ways. For one thing, it is possible to present passengers with regional content that also takes the actual bus route into consideration. Then, campaigns can be initiated according to the time of day. For example, in the morning and evening hours, the kind of advertising could be shown that is targeted to the interests of commuters. If the target audience is especially wide spread, the same advertising content can be shown throughout the fleet in all buses at the same time, ensuring that as many passengers as possible get to see a certain advertising campaign.
New digital signage network in Slovenia
Just how well the idea works is demonstrated by innovative applications that are already working successfully in daily transportation, such as that of Ljubljana City Public Transport, the biggest public digital signage network in Slovenia. It comprises 454 displays installed on 128 buses, reaching more than 186,000 daily passengers who travel via bus an average 16 times a month. The digital advertising campaigns can be presented according to a schedule or governed by certain factors, such as the number of passengers on board or a specific bus route. Interaction with passengers also is possible by showing an SMS number that passengers can dial to obtain a link to a mobile portal. Interested customers can then call up further details, subscribe to a newsletter, participate in a prize competition, ask for vouchers, or any other number of interactive promotional activities. Further services are currently being developed.
Passengers respond to digital signage. A survey concerning the GEM public multimedia system shows a high degree of passenger satisfaction: users of local public transportation welcomed the new system and rated it extremely positively. 84% of those questioned said that they regularly read the differing content on the digital signage displays, and the majority reckoned the GEM public multimedia system was a positive new feature in the nation’s capital. Research into the satisfaction of passengers traveling on Ljubljana City Public Transport with GEM public multimedia was conducted by the ISIS Institute in January 2010 (survey sample: N = 192 respondents).
Convenient remote management
Updating the content presented on the digital signage displays is managed wirelessly over a remote link. As well as being able to change the information from a central point in a speedy and uncomplicated way, there also are further advantages, which include enhanced availability. This is because the remote link also transports diagnostic information such as the operating status of certain hardware components, thereby enabling preventive system maintenance to be carried out and avoiding downtime.
High demands of the hardware platform
The GEM public multimedia network was developed and implemented by Slovenian digital signage specialist GEM Interactive Slovenija (Prumaro d.o.o.). The system sets up on robust industrial PCs as decentralized components to provide the multimedia content on the individual buses. Besides driving a scalable number of displays, these box PCs also implement the wireless connectivity for updating content and for remote diagnostics of hardware. GEM Interactive set high standards for these core components of the system:
“The ideal hardware was to possess an especially powerful graphics chipset for fluid presentation of large-scale animation. Evaluation of a number of options showed that an AMD
Hardware tailored for the job
Interface requirements included a DVI output whose signals were to be distributed by a Cat. 5 extender on low-cost cables with RJ45 connectors to various displays. To power the extender, the box PC was to provide a power supply terminal with a 5 V/12 V output. The wireless connectivity of the system was to be implemented by an HSDPA data card.
Infrastructure of the GEM digital signage network: data is generated on a central server managed over a remote link. Image and video data is transmitted to the individual buses wirelessly and distributed to stationary digital signage stations over cables.
The Kontron KT690/mITX motherboard in an ATX-compatible mini-ITX (mITX) form factor is based on the AMD M690T and SB600 embedded chipsets and the powerful and energy-efficient mobile AMD Sempron™ processors. The range of interfaces on the Kontron KT690/mITX is comparable to that of larger form factors such as ATX. Digital signage
The compact box PC is stowed out of sight behind the maintenance screen and supplies the digital signage displays with image and video data. The integrated HSDPA modem establishes a wireless link for updating content and remote diagnostics of hardware.
Embedded hardware as a quality criterion
The customized box PC is based on a compact KT690/mITX embedded motherboard from Kontron. With its AMD Mobile Sempron processor and embedded chipset, this not only satisfies user requirements concerning performance, graphics, and interfacing, but also is a full-featured embedded component offering at least five-year availability. This was equally important for the customer and the distributor as a long-term assurance of design and supply of spare parts.
The high robustness of the industrial design is a further advantage. With an especially shock- and vibration-resistant processor socket and an operating temperature range from 0 through 60°C, the embedded motherboard demonstrates high reliability in tough environments, making it particularly suitable for all the demands of everyday operation in buses.
Jens Wedenborg is Sales Partner Manager at Kontron
www.kontron.com
Going into Deep Sleep
New techniques are pushing embedded power management beyond Sleep mode, as Jason Tollefson of Microchip Technology Inc., explains
With sleep modes no longer able to deliver the energy economies which can support a new generation of products with decade-long battery life-times, or keep pace with the surge in ‘green’ demands, microcontroller manufacturers are turning to new techniques to take embedded power management beyond the conventional Sleep mode.
Recently, for example, microcontroller (MCU) manufacturers have begun to use electronic ‘switches’ to completely remove power from some parts of the chip when they are not in use; voltage supervisory circuits have also advanced so that they can deliver continuous control whilst drawing the most minimal amount of battery power. By exploring these emerging technologies, some insight can be gained into how they can be implemented for maximum effect.
Sleep shows its age
Traditionally, the MCU’s Sleep mode has been the embedded designer’s most useful power-management tool. But Sleep mode has been around for many years and its age is beginning to
Figure 1: The PIC24F16KA XLP uses Deep Sleep to reduce power consumption
One of the reasons for this is that, over the years, microcontrollers have become more complex with the integration of more features and peripherals. With each increase in complexity, the microcontroller gains additional process nodes, all of which can contribute to energy leakage within the system. Add to this the emergence of products which require battery lifetimes of ten years or more, in applications such as smart utility meters, smoke detectors, as well as increasing legislation to control power consumption and it becomes clear that the traditional Sleep mode simply cannot deliver sufficient power savings.
Deeper than sleep
To offset the effects of increasing complexity and smaller process geometries, MCU manufacturers have introduced new modes for driving down the power draw. Although the names may vary, such as Standby, STOP2, LPM5, or Deep Sleep, their purpose is the same: They are intended to drive down the microcontroller’s need for power beyond the efficiencies achieved by Sleep mode.
All Deep Sleep techniques work by using embedded software-controlled switches to remove power from significant areas of the microcontroller. Powering off the transistors in areas of the chip removes transistor leakage and therefore significantly extends battery life. In Deep Sleep mode, the green circuits in Figure 2 will continue to draw power, whilst the other circuits will have their power removed.
Not all manufacturers achieve the same level of power-savings from Deep Sleep. Typically most achieve an 80% reduction in sleep current, but some MCUs now achieve Deep Sleep currents as low as 20 nA. The combination of low currents in Deep Sleep mode, with batteries which achieve low self-discharge rates, can add years to the battery-life of an application.
The Deep Sleep trade-off
Of course, every new advance brings a new trade-off and, for Deep Sleep mode, this trade-off is a slower start-up time.
Typically, it takes between 1-10 µs for an MCU to wake from standard Sleep mode but, depending on the manufacturer, an MCU can take 300 µs-3 ms when waking from Deep Sleep. The longer start-up is needed for the power-up sequences to terminate and the on-chip regulators to stabilize. Waking from a Deep Sleep mode is very similar to a full Power-on Reset.
Figure 2: Deep Sleep enables some circuits and removes power from others
Wake-up call
Waking a MCU from Deep Sleep is different to waking it from Sleep mode. Traditional Sleep mode has a number of ways to wake the MCU, such as interrupts, timers, communication reception, end of ADC conversion and supply-voltage changes. Some, but not all, of these wake-up sources have been included by MCU manufacturers in their Deep Sleep modes. Sources of wake-up available in Deep Sleep mode can include interrupts, reset pins, power-on reset, real-time clock alarms, watchdog timers and brownout detection. What is missing here is wake-up from communication reception and end of ADC conversion. Since these portions of the device do not have power, those wake-up features cannot be supported in Deep Sleep mode. As different manufacturers may choose to use different implementations for wake-up, it is important to review the wake-up capabilities provided by different microcontroller families.
Some vendors, for example, only exit Deep Sleep by the assertion of the RESET pin. This works for applications that have an “on” button and consumes no additional current. Pressing the button, wakes the application from Deep Sleep, restores its state and the product is ready to go. This works for applications such as thermometers and handheld devices and can also be used to lengthen the shelf-life of battery-powered products, because they can be shipped them in the Deep Sleep state.
Other vendors use a more complete system implementation and have included more flexibility by adding real-time clock and calendar functions. These allow the application to be autonomous and may add as little as 500 nA to the Deep Sleep current. Rather than waiting for a button to be pressed, the clock’s alarm wakes the device. This is important for applications such as smoke detectors which must wake two or three times per minute to sample the air quality, or for a battery-powered sensor that wakes a few times per day to transmit data.
Dramatically longer battery lifetimes can be achieved by matching each application to specific Deep Sleep wake-up features,
End-of-life
Even though Deep Sleep increases battery lifetime there will undoubtedly still be a time when the battery reaches its end-of-life and the risk of improper operation increases.
Typically, supervisory circuits such as Brownout Reset (BOR) circuits and Watchdog Timers (WDTs) are used to protect against this. Brownout circuits can detect if the battery output is too low for safe operation and force the application into a safe state. Watchdog timers offer similar protection against errant code execution, if the MCU attempts to execute in unsafe voltage or frequency conditions. The main problem with these circuits is their current consumption, which can typically be as high as 5-50 µA. In a MCU which aims for benchmark energy-consumption by using Deep Sleep mode, the power consumed by these traditional solutions is unacceptable.
The latest MCUs overcome this by introducing a number of lower-current BOR and WDT circuits, specifically designed for Deep Sleep mode.
Known as Deep Sleep BOR (DSBOR) or Zero-Power BOR, these brownout circuits tradeoff accuracy in return for current consumption which can be as low as 45 nA. This not only protects the product at the end of battery life, but also protects against momentary power loss due to battery holder flex, which is common in battery-powered systems. The way in which low-current BOR is implemented varies between vendors: some may be turned off whilst other are permanently on. As not all MCU manufacturers provide a BOR for Deep Sleep it is important to check the MCU for its compatibility with each application.
A few vendors have also reduced watchdog-timer currents in MCUs with Deep Sleep achieving a current draw which can be as low as 400 nA.
These improvements in current consumption mean that both supervisor circuits can now remain powered while in Deep Sleep, with a combined current consumption as low as 445 nA. This achieves a 99% lower current consumption than in the previous generation of MCUs. By using the equation shown above, the break-even time (Tbe) with both supervisor circuits is shown to be only 5.9 seconds. The current consumption of these new supervisory circuits, therefore, enables safer operation for a whole range of applications that sleep for longer than 6 seconds.
Despite these trade-offs there are many applications that can benefit from Deep Sleep. The difficulty, of course, is in determining which applications should implement Deep Sleep and which should not. The following simple equation can answer this question:
Tbe = ((Tinit*Idd)+(Tpor*Ipor))/(Ipdslp-Ipdds)
Where:
Tbe = Breakeven Time where charge in Sleep equals charge in Deep Sleep
Tinit = Initialisation time to resume full-power operation
Idd = Current consumed during run mode
Tpor = Time required for Power-on Reset
Ipor = Power-on Reset Current (including regulator stabilisation capacitor current, if present)
Ipdslp = Static Current in Sleep Mode
Ipdds = Static Current in Deep Sleep Mode
(Equation courtesy of Microchip: Application Note AN1267)
The above equation models the charge in Sleep and Deep Sleep. The break-even time, Tbe, is the point at which the charge in each mode is equal. Deep Sleep provides the maximum benefit beyond Tbe, as shown in the following example.
Assume that the MCU with Deep Sleep mode has the following characteristics:
Initialisation execution time (Tinit) = 200 µs
Current during execution (Idd) = 400 µA
Power-on Reset Time (Tpor) = 600 µs
Current in POR (Ipor) = 30 mA*
Current in Sleep mode (Ipdslp) = 3.5 µA
Current in Deep Sleep mode (Ipdds) = 28 nA
*30 mA includes current for regulator stabilisation capacitor
Therefore:
Tbe = Tpd = ((Tinit*Idd)+(Tpor*Ipor))/(Ipdslp-Ipdds) = ((200µs * 400µA)+(600µs * 30mA))/(3.5µA – 28nA) = 5.2 s
So, with Tbe equal to 5.2 seconds, an application that remains in Deep Sleep for longer than 5.2 seconds will benefit.
Deep Sleep
Whilst shrinking process geometries in new MCUs deliver increased integration and functionality, traditional Sleep modes can no longer offset the higher current leakage from greatly increased transistor counts.
Microcontroller vendors, therefore are turning to new Deep Sleep modes, in which parts of the circuit can be completely powered down when not in operation.
This, in combination with more power-efficient wake-up circuits, can achieve Deep Sleep currents which are 80% lower than the previous power-management techniques.
Whilst Deep Sleep mode can dramatically increase battery life in MCU-based applications, it is important to consider the power break-even point, where the power saved is greater than the power required to wake the circuit from its powered-down sleep. The simple equation shown above allows embedded designers to make this judgment call and to create a new generation of battery-powered products with incredibly long battery-life.
www.microchip.com
ODU MINI-SNAP - Products for Your Success
ODU develops reliable solutions in the connector area for many well-known companies.
The result? High quality innovative products for the global market. These connector systems offer clear benefits
: • Very large number of mating cycles for profitable demands
• Absolute contact stability for reliable action
• Easy condition for quick action
• Unmistakable connector position for reliable work
• High visibility for faultless handling.
ODU MINI- SNAP Connectors
ODU offers five different series of cylindrical miniature connectors.
* Series L and F are compatible with the connectors produced by companies with the same field of application.
This is the optimal solution by custom specific developments.
Cable assembly using ODU MINI-SNAP
Two of the options of connecting the strands to the contacts/
terminals are soldering and crimping. The cable manufacturer
carries out every single work step required for the final product. Briefly, final product requires cutting, multiple wire preparation, soldering, potting (for water tightness), over molding, testing and packaging. ODU could offer turnkey connector assembly solutions entirely processed within our facility.
Contact:
Eng. Alina Cibu
E-mail: alina.cibu@odu-rom.ro
www.odu-rom.ro
ODU ROM Manufacturing - Sibiu, Romania
Tel: 0748144488; Fax: 0269 221006
For general information visit: www.odu.de
Two in One: The First AMD Fusion processor takes embedded computing to the next level
AMD Embedded G-Series platform combines low power CPU and programmable GPU into a compact and powerful APU package.
With the launch of the AMD Embedded G-Series platform AMD has set a new benchmark for embedded computer technologies. The platform is the world’s first to integrate both a low power CPU and an advanced DirectX® 11 capable GPU into a single embedded Accelerated Processing Unit (APU). Working in conjunction with the advanced x86 processor cores, the APU’s multiple vector cores enable software developers not only to create innovative new “number crunching” applications that expand embedded computing application areas, but also enable many existing embedded computer applications to run much faster without exceeding the existing power envelopes of SFF devices.
This also makes the AMD Embedded G-Series platform ideally suited to become the successor for most of the competing embedded platforms ranging from low power mobile embedded devices up to rugged industrial servers at the top edge of embedded.
The support of new tools such as DirectCompute and OpenCL™ for thread-level and data-parallel application development simplifies the task of creating new applications.
Today’s CPUs lack the performance
Approximately every two years, advances in semiconductor technology allow chip architects to double the number of transistors they can fit in a given area of silicon. Over the past decade, these extra transistors have been used to increase the size of on-chip caches and add more ?86 processor cores to designs, making today’s CPUs the fastest processors ever. But even as fast as they are, today’s CPUs lack the performance to deliver a vivid, modern computing experience on their own. The latest applications require CPUs that can deal with vast amounts of data and require hundreds, if not thousands of individual threads to manipulate the massive databases needed e.g. for real-time pattern recognition in quality control, sonar or radar data analysis, video surveillance or medical imaging applications like the detection of anomalies in a 3D X-ray image – to name just a few. Not surprisingly, traditional CPU architectures and application programming tools optimized for scalar data structures and serial algorithms are not the best match for these new vector-oriented, multi-threaded and data-parallel models.
Programmable vector processors improve processing speed
Fortunately, innovative architectures and tools better suited to these new workloads have emerged. Graphics processing units (GPUs), originally intended to enhance 3D visualization, have evolved into powerful, programmable vector processors that can accelerate a wide variety of software applications. Soft?ware tools like Direct Compute and OpenCL™ permit developers to create such applications based on open standards that combine the power of CPU cores and programmable GPU cores, and run on a wide variety of hardware platforms. Several ambitious independent software vendors (ISVs) have already added support for these new vector capabilities into their most advanced products, but until now, they had to structure their code around proprietary hardware and software interfaces to get the job done. As one can imagine, this required a lot of effort and the results were often suboptimal.
AMD’s new Accelerated Processing Units (APUs)
The new AMD Fusion APU-based Embedded G-Series platform is for the first time eliminating these barriers by design. AMD’s new APUs com?bine general-purpose ?86 CPU cores with truly programmable GPUs on a single silicon die. This enables OEMs to create new generations of applications and user interfaces without the constraints of the traditional CPU architectures that have dominated the computer industry for decades. Others have also lashed a CPU and a basic graphics unit together in a single package, but none have attempted this feat with truly programmable GPUs, let alone GPUs that can be programmed using high-level industry-standard development tools like DirectCompute and OpenCL™. The new APUs will appear just like today’s DirectCompute and OpenCL™ platforms from the viewpoint of the software that runs on the platform.
With an area of only 361 mm2 the AMD G-Series APU is extremely space efficient.
Outstanding multimedia and visual experience
First, the new AMD Embedded G-Series platform enables a full multimedia and Internet experience and a new level of visual performance with 87% improvement in the 3DMark06 score1 and over three times the performance per watt compared to the previous low power generation2. Prior to the AMD Embedded G-Series platform, the use of discrete graphics devices or add-in boards was required to achieve a comparable level of graphic and video performance which resulted in much higher power consumption. The AMD Embedded G-Series processor is also the first in its category to incorporate DirectX® 11 capable graphics with OpenGL 4.0 and OpenCL™ support.
The availability of these advanced graphics APIs helps the software development community to easily build tomorrow’s applications today. For these applications, the platform also supports dual independent displays through a rich variety of interfaces, including DisplayPort, DVI and HDMI as well as the embedded interfaces LVDS and VGA at a maximum resolution of 2560x1600 pixels. All these enhancements make the AMD Embedded G-Series platform an ideal choice for a wide range of applications in the converging embedded markets.
The new AMD Fusion APU-based Embedded G-Series platform combines one or two x86 processor cores with an array of programmable SIMD engines. Furthermore it also integrates memory and I/O controllers, specialized video decoders, display outputs and bus interfaces.
Innovative Small Form Factor Designs
Owing to the continuous processor design improvements, the AMD Embedded G-Series platform has become a compact, power-optimized design. The integration of the APU device reduces the footprint of a traditional three-chip platform to two chips. The APU and its companion controller hub simplifies the design, requiring fewer board layers and a smaller power supply. With a 48% area efficiency improvement compared to the previous platform generations3, the small footprint and low power consumption help reduce overall system costs and enable fan-less ultramobile devices, such as TabletPCs for logistics and healthcare, to run longer between battery charges.
Minimized Product Life Cycle Costs
With an array of performance options, ranging from a 1.2GHz single-core APU up to the 2 ? 1.6GHz dual core variants, the AMD Embedded G-Series platform enables OEMs to utilize single board designs for the whole span - from entry-level up to high-end solutions. Thus one platform can be utilized for a whole span of product variants, e.g. for a product family of panel PCs ranging from low-power up to high-performance versions. And if one has developed a new system based on this platform, the reusability factor for a new design is tremendous because the processor’s high scalability covers up to 80 percent of today’s performance requirements in all embedded markets.
This commonality of the scalable platform design simplifies the supply chain and helps minimize operational complexity, along with the associated costs, helping to drive better platform economics.
The single, scalable platform design helps OEMs reduce development costs, optimize solutions and increase product stability. Furthermore AMD’s embedded lifecycles help to ensure the long-term availability of the platform which is essential, especially for the non-CE embedded computing markets.
Conclusion
The AMD Embedded G-Series platform provides embedded customers with a complete and scalable, long term supported platform that helps to speed up system design and development cycles and time to market for applications, which offer an outstanding performance and visual experience, while maintaining very low power consumption. With all these benefits available on a dramatically reduced footprint, it is not surprising that parallel to the launch of the new AMD Embedded G-Series platform, several embedded hardware manufacturers, such as Compulab, Congatec, Fujitsu, Kontron and Quixant have announced they plan to support the world’s first APU on a broad range of embedded form factors. With the introduction of one of its most competitive technologies to date, AMD’s new APU technology is a compelling solution which is not only suitable for up to 80% of the entire embedded market, but also, and excitingly so, has the potential to revolutionize the embedded computing market itself. Thus, OEMs should consider evaluating this new technology in their endeavour to fulfil customers' demands for a vivid user experience and massive data throughputs in all offered performance classes.
1 When comparing the AMD G-T56N processor to the AMD AthlonTM Neo L325/780E Platform.
• The AMD G-T56N 3DMark06 (1280 x 1024) score of 1938
• AMD ASB1 AthlonTM Neo 325/780E platform, 3DMark06 (1280 x 1024) score of 1033
• (1938-1033)/1033 = .876 x 100 = 87%
• Internal testing of current vs. previous generation AMD processor-based embedded system as of October 13, 2010 showed 87% improvement of 3DMark06 over previous generation. Current system:
AMD G-T56N APU, Inagua development platform, 2GB RAM, Windows 7. Previous generation: AMD Athlon™ Neo L325 processor, MSI 9858 motherboard, 2GB RAM, Windows 7
2 When comparing the AMD G-Series T44R Platform to the AMD SempronTM 210U/780E platform running 3DMark06.
• T44R: 1401(3DMark06 1280 x 1024) / (9+4.7) = 102.3 3DMarks/Watt
• >> AMD SempronTM 210U/780: 1000 (3DMark06 1280 x 1024)/ (15W+13W+4.5W)=30.8 3DMarks/Watt
• >> 102.3/30.8 = 3.32
• Internal testing of current vs. previous generation AMD processor-based embedded systems as of October 13, 2010 showed more than 3X graphics performance-per-watt advantage for the current generation. Current system: AMD G-T44R APU(9W TDP), Inagua development platform, 2GB RAM, Windows 7. Previous generation: AMD Sempron™ 2010U processor (15W TDP), MSI 9858 motherboard, 2GB RAM, Windows 7. Graphics performance-per-watt calculated based on 3DMark®06 benchmark divided by solution thermal design power (TDP).
3 The AMD G-Series Platform offers a 48% smaller footprint over the previous generation.
• G-Series APU (19 x 19)361mm2 + G-Series FCH (23 x 23) 529mm2 = 890mm2
• ASB1 729 mm2 + 780E 441 mm2, + SB710 529 mm2 = 1699mm2
• (1699mm2 - 890mm2 )/1699mm2 x 100 = 48%
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